Industry News | 2010-10-27 20:21:50.0
Palomar Technologies, a leading supplier of solutions for microelectronic and optoelectronic packaging, announces that it has been awarded a Global Technology Award in the category of Bonding Equipment for its 3800 Ultra Flexible Die Bonder.
Industry News | 2003-06-19 09:00:08.0
Leading provider of manufacturing services applies
Industry News | 2003-04-16 10:58:03.0
Award presented for Palomar's Gold Connection
Industry News | 2011-07-18 12:57:31.0
The Solar Engineering & Manufacturing Association (SEMA) announces that it held a standing room only meeting on July 14 at the Palomar Hotel in San Francisco in conjunction with the recent Intersolar NA/SEMICON West expos.
Industry News | 2018-03-13 18:47:01.0
TopLine will once again be the premier sponsor of the upcoming IMAPS Wire Bonding Conference. In making the announcement, TopLine CEO Martin Hart stated that he is delighted to support the conference as the leading sponsor for the second time. The Wire Bonding workshop and tabletop exhibition will be held October 8, 2018 in California at the Pasadena Convention Center. The event is co-located with the IMAPS 51st Symposium on Microelectronics.