Quik-Pak, a division of GEL-PAK, offers state of the art clean room manufacturing and enhanced product capabilities which include MLF and MLP IC plastic packages. Quik-Pak offers unlimited open cavity plastic package configurations. Quick-Turn dicing
New Equipment | Industrial Automation
MDL-DT4C MDL-DT4C ZhongHaiDe (Fujian) Industrial Equipment Co., Ltd., is located in the center of the provincial capital of Fujian Province, relying on the advantages of customs declaration in Mawei Fr
Industry News | 2013-01-02 16:01:34.0
A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components
Industry News | 2011-05-03 22:50:52.0
Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.
TI New and Original LM73606QRNPTQ1 in Stock IC WQFN30 19+ package LM73606QRNPTQ1 3.5V to 36V, 6A Synchronous Buck Converter FXLS60230AESR2 N/A NXP 21+ MSP430F67641AIPZR LQP100 TI 19+ MSP430F6733AIPNR LQFP-80 TI 22+ TMS320C6678ACYPA25 BGA TI
TI New and Original LM6172IMX/NOPB in Stock IC SOP-8 20+ package LM6172IMX/NOPB Dual High Speed, Low Power, Low Distortion Voltage Feedback Amplifier FXLS60230AESR2 N/A NXP 21+ MSP430F67641AIPZR LQP100 TI 19+ MSP430F6733AIPNR LQFP-80 TI 22+
