Industry News | 2017-10-05 05:41:24.0
IPC's Study of Quality Benchmarks for Electronics Assembly 2017 is now available. The annual study provides valuable benchmarking data to electronics assembly companies interested in comparing quality measurements to industry averages.
Industry News | 2018-07-11 20:37:51.0
IPC's Study of Quality Benchmarks for Electronics Assembly 2018 is now available. The global study provides valuable benchmarking data to electronics assembly companies interested in comparing their quality measurements to those of the industry worldwide.
Industry News | 2019-08-12 20:10:19.0
IPC's Study of Quality Benchmarks for Electronics Assembly 2019 is now available. This global study provides valuable benchmarking data to electronics assembly companies interested in comparing their quality measurements to those of the industry worldwide.
Industry News | 2019-03-10 20:30:11.0
The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products. A number of IPC OEM member companies have approached IPC with examples of microvia failures in high-profile hardware that were not observed until after bare printed board fabrication, inspection and acceptance, including:
Industry News | 2013-06-26 09:09:19.0
The SMTA announced Harald Grumm from Christian Koenen GmbH as the recipient of the Best of Conference Award for his presentation “The Potential of Stencil Technology – Choosing the Right Stencil Options to Maximize Yield and Earnings” at the 9th Annual International Conference on Soldering and Reliability, held May 14-17, 2013 at the Sheraton Toronto Airport, Ontario, Canada.
Industry News | 2012-10-22 16:10:06.0
Multitest announces that its Mercury™ contactor with Q-tip successfully passed a two-month evaluation at a US-based IDM with test operations in Southeast Asia with excellent first-pass yield for more than 500k insertions.
Industry News | 2013-12-10 12:14:34.0
Indium Corporation introduces a new Pb-free solder paste designed to combine best-in-class stencil printing performance, using Indium's unique halogen-free oxidation barrier technology with optimized no-clean residues for enhanced probe testing. Indium8.9HF1-P saves time and money on testing by eliminating false failures and giving the highest first pass yields.
Industry News | 2014-01-09 18:39:42.0
Storagesolutions announces the appointment of Suba Engineering as its distributor throughout Australia, New Zealand and the Pacific Islands.
Industry News | 2023-04-11 09:40:15.0
Silicon Mountain announced that its annual multi-million placement accuracy statistics for first pass yield continue to grow. The company uses surface mount technology (SMT) machines, including the award-winning Fuzion and Advantis Platforms from Universal Instruments. These machines offer the latest, innovative technology in SMT. They enable Silicon Mountain to print, place, and reflow components in a variety of sizes from
Industry News | 2013-11-01 13:32:41.0
Indium Corporation's Indium8.9HFA Solder Paste is a versatile, halogen-free, Pb-free, solder paste with leading print performance on miniaturized components. Assemblers and OEMs are adopting this remarkable new product at an accelerating pace.
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