Industry Directory: passive component recommended footprint (2)

Vishay Intertechnology, Inc.

Vishay Intertechnology, Inc.

Industry Directory |

One of the world's largest manufacturers of discrete semiconductors (diodes, rectifiers, MOSFETs, optoelectronics, and selected ICs) and passive electronic components.

Labtech Microwave

Labtech Microwave

Industry Directory | Manufacturer of Components

Labtech is a UK based specialist high technology company offering Broadband Microwave Components and a range of related Microwave Manufacturing Services. Labtech is a subsidiary of Intelek plc www.intelek.plc.uk , a LSE listed company.

New SMT Equipment: passive component recommended footprint (122)

SV-100 Slider Valve Solder Paste Dispenser

SV-100 Slider Valve Solder Paste Dispenser

New Equipment | Dispensing

Nordson ASYMTEK’s SV-100 Slider Valve dispenses paste-type fluids with metal additives better than traditional needle dispensing, using slider valve technology. This technology utilizes high-frequency, piezoelectric-drive actuation to quickly deposi

Nordson ASYMTEK

Spectrum II S2-900 Series Fluid Dispensers

Spectrum II S2-900 Series Fluid Dispensers

New Equipment | Dispensing

Scalable Fluid Dispensers for Assembly of Semiconductors, MEMS, Storage Devices, and PCBs. High Speed, High Accuracy, Precision Dispensing System. The Spectrum II Series is the next evolution of the widely successful Spectrum fluid dispensers from

Nordson ASYMTEK

Electronics Forum: passive component recommended footprint (40)

132 QFN footprint

Electronics Forum | Wed Jul 25 10:57:08 EDT 2007 | cecil

Our board layout folks are currently designing a PWB using a 132 QFN. The component is .5mm pitch with .35mm square pads. The component manufacturer recommends the following footprint: .4mm square land .3mm square solder resist 1.why do they spec

Deciding On pad size using just the component footprint

Electronics Forum | Sat Jul 24 09:06:40 EDT 2004 | davef

We believe that many manufacturers' recommended pads should be close to the last resort. Recommendations are: * Standardize with the IPC guidelines or those by Jim Blankenhorn [ smtplus.com ]. Anyone that wants to change from that standard needs to

Used SMT Equipment: passive component recommended footprint (2)

Agilent 81595B 1x4 Optical Switch Module

Agilent 81595B 1x4 Optical Switch Module

Used SMT Equipment | General Purpose Test & Measurement

10 Mio. cycles PDL Highest repeatablity specified over 10.000 random switch cycles: 0.03dB Description The plug-in module for Keysight's Lightwave Solution Platform 8163B, 8164B, 8166B is ideal for flexible system configuration in applications s

Shenzhen Zhongce Photoelectric Technology Co., LTD

Branson EVD 40

Branson EVD 40

Used SMT Equipment | Board Cleaners

The Branson Precision Cleaning Division of Branson Ultrasonics Corporation introduces an EVD Ecological Vapor Degreaser. The EVD is a non-aqueous single-chamber cleaning system, providing continuous, closed-loop regeneration of cleaning liquid by vac

Fix Trade BV

Industry News: passive component recommended footprint (58)

Europlacer to Highlight Xpress 25 at Productronica 2007

Industry News | 2007-11-04 19:29:37.0

DORSET, UNITED KINGDOM - November 2, 2007 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will display the Xpress 25 flexible high-volume SMT placement system in booth A4-125 at the upcoming Productronica 2007 exhibition and conference scheduled to take place November 13-16, 2007 at the New Munich Trade Fair Center in Munich, Germany.

EUROPLACER

Tens of Millions of Footprints & 3D Models for FREE

Industry News | 2017-05-11 17:06:16.0

Library Expert Lite automatically builds footprints and 3D STEP models for tens of millions of parts, for free.

PCB Libraries, Inc.

Technical Library: passive component recommended footprint (84)

Surface Mount Rework Techniques

Technical Library | 1999-05-09 12:51:38.0

This Technical Note outlines, step by step, the easiest ways to remove and replace surface mounted devices, using the lowest possible temperatures. This document discusses the following topics: Removal and replacement of discrete and passive components (capacitors, resistors, SOTs), Removal of two-sided components (SOICs, SOJs, TSOPs), Removal of quad components (PLCCs, QFPs), Replacement of quad components including fine-pitched devices.

Metcal

Advanced Packaging of SMT Assemblies for Greater Cost Reduction

Technical Library | 2019-06-06 13:40:47.0

Legacy electronics assemblies, such as through-hole (Figure 1) and connectorized component packages, are robust and prevalent throughout industry. However, each of these assembly methods have reached their limits in terms of weight, volume, reliability, and most importantly cost. With cost reduction of assemblies now the primary focus area throughout the electronics industry, there is more of a need than ever to implement the latest advancements in surface mount technology (SMT) into electronics assembly designs. Although SMT has been utilized in the electronics industry for many years, implementation of the technology is still in the ever-evolving process of reducing component footprint size, component spacing, and component I/O pitch. Implementation of the most up-to-date SMT processes provides optimal weight, volume, and cost savings, for any type of assembly.

ACI Technologies, Inc.

Videos: passive component recommended footprint (2)

Solder Paste capabilities with the SV-100 Slider Valve

Solder Paste capabilities with the SV-100 Slider Valve

Videos

Dispensing dots, lines and into recessed cavities. Video was shot with a lipstick camera mounted to the dispense head. http://www.nordsonasymtek.com

Nordson ASYMTEK

PCB Library Expert

PCB Library Expert

Videos

The PCB Library Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts footp

PCB Libraries, Inc.

Training Courses: passive component recommended footprint (1)

Void Formation in Solder Joints - Causes & Cures - Online Webinar

Training Courses | | | PCB Assembly Courses

The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.

ASKbobwillis.com

Events Calendar: passive component recommended footprint (2)

Void Formation in Solder Joints - Causes & Cures

Events Calendar | Mon May 16 14:30:00 EDT 2016 - Mon May 16 16:00:00 EDT 2016 | , United Kingdom

Void Formation in Solder Joints - Causes & Cures

ASKbobwillis.com

Void Formation in Solder Joints – Causes & Cures

Events Calendar | Mon May 18 14:30:00 EDT 2015 - Mon May 18 02:30:00 EDT 2015 | Chelmsford, Essex, United Kingdom

Void Formation in Solder Joints – Causes & Cures

ASKbobwillis.com

Express Newsletter: passive component recommended footprint (713)

Partner Websites: passive component recommended footprint (555)

Conformal Coating Systems & Equipment - Nordson ASYMTEK

Nordson ASYMTEK | https://www.nordson.com/en/divisions/asymtek/products/conformal-coating-systems?con=t&page=39

Spectrum II Dispensing System Nordson ASYMTEK Spectrum II dispenses with precision and speed in a small footprint Electronics - Semiconductor Nordson ASYMTEK Encapsulant Nordson ASYMTEK These products

Nordson ASYMTEK

International Conference for Electronics Hardware Enabling Technologies

Surface Mount Technology Association (SMTA) | https://www.smta.org/icehet/workshops.cfm

. Course registration is complimentary with the purchase of a conference registration pass. PDC1: QFN Component Technology: Manufacturing Implementation and Solder Joint Reliability Instructor

Surface Mount Technology Association (SMTA)


passive component recommended footprint searches for Companies, Equipment, Machines, Suppliers & Information

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Easily dispense fine pitch components with ±25µm positioning accuracy.


Software for SMT placement & AOI - Free Download.
Green Monster Stencil Wiping Rolls

Thermal Transfer Materials.