Industry Directory | Manufacturer
5N Plus is a Canadian producer of high-purity metals and compounds for electronic applications best known as the major supplier of Cadmium Telluride (CdTe) to First Solar.
Industry Directory | Manufacturer
AIM is a leading global manufacturer of solder assembly materials for the electronics industry.
New Equipment | Solder Materials
AIM's NC273LT solder paste formula with bismuth containing alloys can provide an assembler with an innovative solution when temperature sensitivity is paramount. The revolutionary activator system in AIM's new NC273LT low temperature solder paste im
New Equipment | Solder Materials
Tokyo, Japan – Koki Company Limited, global manufacturer and supplier of soldering materials, announces the release of new low Ag containing halogen free solder pastes that secures the equivalent joint reliability and heat profile to SAC305, namely S
Electronics Forum | Tue Nov 06 22:37:35 EST 2012 | davef
Ryan ... "As for bismuth-based lead-free alloys, a lower melting temperature than that of tin-lead is offered together with a cost similar to that of tin [in the area of $3/lb]. Unfortunately, bismuth in soldering alloys tends to create embrittlemen
Electronics Forum | Thu Nov 15 03:07:35 EST 2012 | nikyta
Thanks for your reply. As already said by Anvil1021, is not a good idea to mix Lead and Bismuth! Stay away from Bismuth if you have even the slightest traces of Lead on yours PCB, stencil, squeegee, spatula, blade, cleaning paper or cleaning cloths,
Industry News | 2023-03-16 14:31:59.0
The SMTA is pleased to announce the Best Papers from SMTA International 2022. The winners were selected by members of the conference technical committee. For these exceptional achievements, a plaque is given to primary authors of all winning papers.
Industry News | 2018-01-15 13:37:11.0
The SMTA is pleased to announce the Best Papers from SMTA International 2017. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. For these exceptional achievements, a cash award and plaque are given to all winners.
Technical Library | 2013-01-24 19:16:35.0
The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive components and boards are used this has created a need to develop low melting point lead-free alloy solder pastes. Tin-bismuth and tin-bismuth-silver containing alloys were used to address the temperature issue with development done on Sn58Bi, Sn57.6Bi0.4Ag, Sn57Bi1Ag lead-free solder alloy pastes. Investigations included paste printing studies, reflow and wetting analysis on different substrates and board surface finishes and head-in-pillow paste performance in addition to paste-in-hole reflow tests. Voiding was also investigated on tin-bismuth and tin-bismuth-silver versus Sn3Ag0.5Cu soldered QFN/MLF/BTC components. Mechanical bond strength testing was also done comparing Sn58Bi, Sn37Pb and Sn3Ag0.5Cu soldered components. The results of the work are reported.
Technical Library | 2012-12-20 14:36:09.0
The increased function of personal electronic devices, such as mobile phones and personal music devices, has driven the need for smaller and smaller active and passive components. This trend toward miniaturization, occurring at the same time as the conversion to RoHS-compliant lead-free assembly, has been a considerable challenge to the electronics assembly industry. The main reason for this is the higher reflow process temperatures required for Pb-free assembly. These higher temperatures can thermally damage the PCB and the components. In addition, the higher reflow temperatures can negatively affect the solder joint quality, especially when coupled with the smaller paste deposits required for these smaller components. If additional thermal processing is required, the risk increases even more. First Published at SMTA's International Conference on Soldering and Reliability in Toronto, May 2011
SMTnet Express January 24, 2013, Subscribers: 26136, Members: Companies: 9096, Users: 34208 An investigation into low temperature tin-bismuth and tin-bismuth-silver lead-free alloy solder pastes for electronics manufacturing applications
Advantages of Bismuth-based Alloys for Low Temperature Pb-Free Soldering and Rework SMTnet Express December 20, 2012, Subscribers: 26064, Members: Companies: 9072, Users: 34080 Advantages of Bismuth-based Alloys for Low Temperature Pb
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
• Profile shape is similar with slightly higher peak temperatures. • Both Nitrogen and Air atmospheres can be used with equal success. (Depends on paste formulation and manufacturer’s recommendation
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
Lubrication Systems Mixers Pest Control Systems Reservoirs and Pumps Solder Paste and Flux Syringe Barrels and Cartridges Thermal Compounds (TIM) Two-Component (2k
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