SMT Express, Issue No. 3 - from SMTnet.com Volume 1, Issue No. 3 Wednesday, August 18, 1999 Featured Article Return to Previous Page BGA REWORK Earl Moon Proof Of Design (POD) SOLDER PASTE APPLICATION (WHEN AND AS SPECIFIED) Select
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), decreasing cooling and condensation efficiencies. The time period for this may vary depending on the type of solder paste flux used, the weekly consumption rate of paste, and oven temperature profiles
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