Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
Industry Directory | Manufacturer
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog
New Equipment | Education/Training
Failure Analysis Techniques for Electronics provides an overview of the characterization methods available at ACI Technologies, Inc. for determining the causes of failure in electronics devices. This publication will assist the reader in making inf
Electronics Forum | Wed Feb 09 21:41:49 EST 2005 | Grant
Hi, We have been running the same stencils for about a year, 5 thou thick, 1-mm pitch BGA's and every-things been ok, but then suddenly over the last week, 2 different products have had paste release issues with the BGA. It's odd because nothings c
Electronics Forum | Wed Dec 18 12:04:53 EST 2002 | slthomas
That issue (gasketing is what I usually see it called) was the driving force behind us getting new printers. Our old semi-auto clamshells just weren't repeatable enough, particularly over changes in squeegee travel direction. If the paste in the
Used SMT Equipment | Screen Printers
Substrate processing: Maximum substrate size (XxY): 609.6mmx508mm(24”x20”) For circuit boards larger than 20”, special fixtures are required Minimum substrate size (XxY): 50.8mmx50.8mm(2”x2”)
Used SMT Equipment | Screen Printers
2007 EKRA X4 Solder Paste Screen Printer, CE Marked, 208V, L to R Board Flow with 2.5D inspection, Laser Guided pin tooling and Auto Stencil cleaner. Currently in production, being released soon. FOB: Origin USA Contact: AssuredTechnicalServiceLLC@G
Industry News | 2012-03-05 14:26:45.0
GPD Global has been awarded a 2012 NPI Award in the category of Dispensing Equipment for its PCD Dispensing on the MAX Series Platform.
Industry News | 2003-03-21 08:12:24.0
Tecan reckons it is consistently producing what may be regarded as the most efficient stencils in the world today.
Parts & Supplies | Chipshooters / Chip Mounters
7WL ASSY (ø1.2 / 0.6) Issues related to improper nozzle/feeder maintenance or use of poor quality nozzles are often the same. Here are some of the most common problems: 1. Poor pickup location on part. It will cause a loss of vacuum and re
Parts & Supplies | SMT Equipment
7WL ASSY (ø1.2 / 0.6) Issues related to improper nozzle/feeder maintenance or use of poor quality nozzles are often the same. Here are some of the most common problems: 1. Poor pickup location on part. It will cause a loss of vacuum and result in
Technical Library | 2019-06-07 14:49:54.0
ACI Technologies was contacted in regards to poor solder joint reliability. The customer submitted an assembly that was exhibiting intermittent opens at multiple locations on a ball grid array (BGA) component. The assembly’s functionality did not survive international shipping, essentially shock and vibration failures, immediately making the quality of the solder joints suspect. The customer was asked about the contract manufacturer and the reflow oven profile as well as the solder paste and surface finish used. The ACI engineering staff evaluated the contract manufacturer’s technique and determined that they were competent in the methods they used for placing thermocouples in the proper locations and developing the reflow oven profile. The surface finish was unusual, but not unheard of, in that it was hard gold over hard nickel, rather than electroless nickel immersion gold (ENIG). The customer was able to supply boundary scan testing data which showed a diagonal row of troublesome BGA pins.
Technical Library | 2019-05-23 10:30:22.0
Increasing I/O numbers, device complexity, and product miniaturization requires high precision bonding tools, and sophisticated equipment. Careful consideration should be given to wedge geometry while selecting the tool for a fine pitch wire bonding application. Wire bonding is a process that creates an electrical connection between a die and a substrate or lead typically using gold or aluminum wire. Wedge bonding is a specific type of wire bonding that uses a wedge shaped tool to create the welds. The design of the wedge tool has changed very little over the past decade. The wire is fed at an angle through the back of the wedge. This angle is typically 30 to 60 degrees and is application dependent. Some applications require a higher feed angle due to package clearance issues. Some deep access applications require a 90 degree feed angle. In this configuration, the wire is fed through a hole in the shank of the wedge tool. Wire feed is shown in Figure 1.
Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog
Precise lines are dispensed to fill an area on a heat sink. At the end of this video, you can see a demo of placing a glass slide on top of the dispensed material to see uniformity of the area. http://www.nordsonasymtek.com
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Mon Mar 18 00:00:00 EDT 2019 - Mon Mar 18 00:00:00 EDT 2019 | ,
Webinar: Stencil Design for Solder Paste, In Process Inspection & Process Defects
Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,
Solder Paste Qualification Testing - SMTA Webinar
Career Center | San Jose, CA, California USA | Engineering,Production,Research and Development
Senior PCB Designer: Want to be part of an exciting pre-IPO enterprise B2B company working on the cutting edge of internet-of-things, artificial intelligence & agents, blockchain, and manufacturing technology? This well-funded venture-backed co
Career Center | Fremont, California USA | Production,Quality Control
Local industry leading EMS Company seeking SMT operators. Will be doing SMT line Change overs, SMT machine operation for solder printing, placement, reflow. Solder paste height measurement and record. Solder printing quality check after solder paste
Career Center | Theni, Tamilnadu India | Engineering
NPI Engineer: • Playing a role as NPI leader of the Telecom, Aerospace & Server Products to introduce and run to qualify the engineering build from customer. • Conducting Weekly NPI meeting with the CFT team to review the progress of the NPI schedu
Career Center | tulsa, Oklahoma | Engineering
Printed Circuit Assembly Process Engineer. Seeking a position in a high-technology operation, utilizing my background supporting a progressive and growth-oriented organization. Offering the technical experience, expertise, and skills gained during th
SMT Express, Volume 4, Issue No. 12 - from SMTnet.com Volume 4, Issue No. 12 Thursday, December 19, 2002 Featured Article The Ways to Win Hearts and Minds Reprinted with permission from The Lean Manufacturing Advisor, Web Edition, July 2002
SMT Express, Volume 2, Issue No. 5 - from SMTnet.com Volume 2, Issue No. 5 Wednesday, May 17, 2000 Special Announcements SMTnet's Premier OnBoard Forumto Feature Charles A. Harper Event scheduled for May 19th Moved to June 6th Due
| https://www.eptac.com/soldertips/soldertips-solderability-issues-with-nickle-plated-surfaces/
. Recent Posts Solder Pot Maintenance and Dross Removal What’s with the expiration dates on solder paste or wire? Accept or Reject: Solder Contacting Component Bodies Issues of Burnt Flux on Class 3 PCB Assemblies Gold Removal Issues with Hollow Cup Connectors Acceptability of Conformal Coating Bubbles Search Looking for Training Products? SolderTraining.com can help
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/efd-products/solderplus-solder-paste
SolderPlus® Solder Paste | Low- & High-Temperature Solder Paste | Nordson EFD Search Arrow Black Arrow Right Arrow Youtube Twitter Facebook Paper Plane LinkedIn Zoom In Grid Envelope Earth Download File - Document 9 Boxes Browser Calendar Chart Click Icon Close