Electronics Forum | Wed Apr 05 23:56:02 EDT 2000 | angela
Recently we have serious problem of our 0.5mm pitch QFP solder bridge. I check the viscosity of the Litton Kester paster. It's roumd about 700 is it too low. And do you have god solution about it? thanks alot
Electronics Forum | Thu Aug 03 09:37:33 EDT 2006 | Simon
Curious if anyone knows... When switching back and forth from Leaded paster to Lead free if cleaned with alcohol can the same squeegees be used? If so could anyone direct me to any links that would back this up. Thanks, Simon SMT Tech, Edge Tech Indu
Electronics Forum | Wed Sep 15 13:28:05 EDT 2004 | Oscar Cortes
Has anyone seen information on the Reflow Reflow soldering method, without using glue? Currently run a Fuji 241 XP and Ecra Paster, however we do not have the glue attachments for double sided boards. I've heard double sided boards can be reflowed
Electronics Forum | Mon Jun 16 23:57:47 EDT 2008 | grantp
Hi, How has it worked for you with small parts such as 0402, and are you using these size parts, and getting any tomb-stoning problems? We used lead paster with our vapor phase, while lead free should have less surface tension, so I have always won
Electronics Forum | Mon May 08 01:47:56 EDT 2000 | Jack
Charles, I think the misplacement can be devided into 2 groups: 1. parts misplaced by machine 2. parts move as the X-Y table moves If you use the solder paster right, and the place force is properly setup, the second group will be definitely no exce
Electronics Forum | Mon Apr 21 06:26:28 EDT 2003 | Grant
Hi, We have a SMT production like, however we have very little experience with through hole assembly. We design everything to be completly SMT based, however connectors are the only part of our product that still requires through hole assembly. Cur
Electronics Forum | Mon May 01 23:23:58 EDT 2006 | grantp
Hi, I off center idea we used when we started. Get a pasta cooker, and put in vapor phase fluid, and then use that. Place the product in the bottom of the inner pot, and then heat on a small hot plate. When the vapor cloud gets high enough and the
Electronics Forum | Fri Apr 08 16:26:36 EDT 2005 | Grant
Hi, It seems weird that an automated pick and place machine at a board shop would not be up to NASA standards, but placing the components by hand would be. However most SMT will self center a bit, so if your close enough, you should be ok. You rea
Electronics Forum | Wed Dec 05 03:33:22 EST 2007 | longlee
We have done Paste-In-Hole process for 4 years.I think this prcess is suitable for 28-pins connector. Of course, you must assure the connecotr can endure high temperature firstly.Secondly, you need calculate the volume of solder paste, you can refere
Electronics Forum | Sat Jun 12 00:34:00 EDT 2004 | kanwal324
Hi ! The main problem being faced currently is formation of solder balls - to be precise, these are micro solder beads generally found attached with bodies of SOTs, Chip Caps, Chip Resistors, between pins of SOICs (50 mil) - lying on PCB surface,