Industry News: pbga defects (Page 1 of 1)

SMTA China Presents Seven Best-Paper Awards at SMTA China South 2009 Conference

Industry News | 2009-09-03 12:06:15.0

SMTA China announces that it presented awards for seven papers at the SMTA China South 2009 Conference Award Presentation Ceremony, held on Thursday, August 27, 2009 at the Shenzhen Ritz-Carlton Hotel in conjunction with the SMTA Hong Kong Chapter Annual Breakfast Reception.

Surface Mount Technology Association (SMTA)

Practical Components Helps Diagnose and Treat Head-in-Pillow Failure PBGA 928-HiP — A large component with a single small die is a recipe for HiP failure

Industry News | 2012-06-01 09:09:55.0

Head-in-Pillow (HiP) soldering defects are common with modern SMT component placement. As a result, Practical Components has introduced the PBGA 928-HiP, a component that is designed specifically to be susceptible to HiP defects. It features a large 4x4 body size, 928 balls and a single small die that has a propensity toward the ball-in-socket HiP soldering defect.

Practical Components, Inc.

Ball Grid Array (BGA) Package

Industry News | 2018-12-08 03:31:22.0

Ball Grid Array (BGA) Package

Flason Electronic Co.,limited

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