Electronics Forum | Tue Mar 25 13:55:05 EDT 2014 | horchak
Ok lets put it this way. If the PCB house used a high quality mask and properly applied it to a properly cleaned surface and properly cured it, then as Dave stated above there are only two things that can destroy it. Excessive heat and overly aggress
Electronics Forum | Wed Mar 19 08:38:13 EDT 2014 | davef
I can't picture much of what you're saying, not for nothing, I'm just not connecting. During assembly, solder mask can affected by heat and chemicals. Typically this would be during: * Soldering * Cleaning I will tell you this: Not to defend assem
Electronics Forum | Sun Apr 07 18:21:08 EDT 2002 | murt
Hi I am a collage student and I was wondering if anyone could explain to me how you would estimate the trough-put, product and cycle time for a double-sided mixed technology pcb assembly. I would be grateful for any information Thanks Martin.
Electronics Forum | Mon Jun 03 13:26:32 EDT 2019 | az2019
Hi, I have a general question about the relationship of PCB thickness and BLR testing result. For example, I have QFN6x6 parts mounted on board in 1.2mm, 1.6mm, and 2.4mm thickness. All boards have 6 layers of Cu. Studies show thicker board gives les
Electronics Forum | Wed Mar 12 07:33:40 EDT 2008 | callckq
Hi All, One PCBA failed test after went through the Shock Test(Vibration) and suspected to be BGA solder ball crack. We performed dye and pry and found PCB's pad lifted with red mark ink penetrate pad underneath, what does this mean? Can I say the
Electronics Forum | Wed Dec 20 04:43:36 EST 2006 | greg york
Any decent flux would volatise off with the heat of the wave unless absorbed into the solder mask. Test this by trying to clean in alcohol or common solvent aerosol, if it does not clean then it is probably Mineral Salts from solder mask fillers. Ano
Electronics Forum | Tue Nov 28 21:16:17 EST 2006 | davef
J Rose at EMPF says: The introduction of no-clean solder fluxes in electronics manufacturing has given rise to greater levels of solder balling simply because the opportunity to remove them in the wash process does not exist. They are typically cause
Electronics Forum | Mon Feb 19 11:36:39 EST 2001 | billschreiber
Hello Mark, I wish it were that simple so I could direct you to a particular manufacturer and stencil cleaner model. Unfortunately, there are several issues complicating the process of cleaning all these applications in one machine. First and fore
Electronics Forum | Tue Aug 31 17:36:36 EDT 2004 | davef
NO-LEAD COMPONENTS WITH LEAD SOLDER ISSUE: We agree with Russ. We've dicussed this several times on SMTnet. For instance, look here http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=25394 LEAD COMPONENTS WITH NO-LEAD SOLDER ISSUE: We disa
Electronics Forum | Fri Dec 17 13:23:15 EST 1999 | Chris
I have an underfill material which takes 6 hours to cure. It works great, better than any other underfill I have ever used. A vertical cure oven is too expensive. I am currently using batch style ovens and opening the oven door as additional produ
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