Electronics Forum: pcb and material and supplier (Page 1 of 10)

multilayer and difficult and high quality pcb supplier

Electronics Forum | Fri Sep 06 03:06:18 EDT 2013 | 5pcb

We are a complex pcb supplier in China. We are good at making prototypes and multilayer (8-20)layers PCB. If you think your boards are difficult enough, you can contact me. Let's talk details. sales2@dmele.com Name:Lily Tel:0086-0755-23006293.

multilayer and difficult and high quality pcb supplier

Electronics Forum | Fri Sep 06 03:11:31 EDT 2013 | 5pcb

Welcome phone call from all over the world.

PCB material Nelco13 and FR4

Electronics Forum | Thu Jun 24 23:57:42 EDT 2004 | George

Could anyone tell me the difference in PCB material Nelco13 and FR4? PCB dielectric material Nelco13 is quite new for me and I knew nothing about it. For imcoming quality control (IQC), I am asked to identify PCB made of FR4 and Nelco13. How to do th

PCB material Nelco13 and FR4

Electronics Forum | Mon Jun 28 01:44:02 EDT 2004 | George

Thanks a lot !

PCB material Nelco13 and FR4

Electronics Forum | Fri Jun 25 07:13:40 EDT 2004 | davef

Nelco was developed by Park [ http://www.parknelco.com/parknelco/highspeed.htm ] Without fairly involved testing, you may be forced to rely on a c of c from your fabricator. Although, Park may be able to give you a lead.

Recommended TG material for CCBGA , CBGA and PBGA's

Electronics Forum | Mon Mar 03 13:22:20 EST 2003 | MA/NY DDave

Hi I see David F already gave a good answer. The basic advantage, if you can afford it, is a more stable PCB during the soldering process. Higher Tg enables this. Also some materials serve to match CTEs (coefficient of thermal expansion) a bit bett

force between the pad and laminate material

Electronics Forum | Tue Jun 11 22:06:06 EDT 2002 | scottxiao

I encounter the problem, it is easy for pad(copper) to drop off from the PCB, which is Ni/Au finish. so my question is whether there is any specification about the force between pad and laminate material, and does the PCB corpoartion test this parame

force between the pad and laminate material

Electronics Forum | Wed Jun 12 08:13:29 EDT 2002 | davef

Don't sound proper. There is no specification. Pad peel strength test methods are: * IPC-TM-650, Method 2.4.21 for multiple solderings * IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical requirement for Cu is: 6 lbf/in [1

force between the pad and laminate material

Electronics Forum | Thu Jun 20 04:49:34 EDT 2002 | scottxiao

according to the ressult of cross-section and removing the component, I find there is no black area in the left pad, and the IMC is also normal, so the black nickle is less impossible. the PCB material is not common FR4, just some thing like ceramic,

Desiccants and pcb finish degradation?

Electronics Forum | Tue May 22 08:43:05 EDT 2001 | ohboy

Wow! I'm going to apply for something at Desiccare, I think... I found similar things about desiccants, but mostly material related stuff, also some concerns more about the indicator card than the desiccant. Nothing conclusive. At the moment, I

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