Electronics Forum: pcb electromigration (12)

Re: Ghost circuit shorts under smt resisters only when they are located on solder side of pcb (glued down)

Electronics Forum | Fri Jul 30 09:43:44 EDT 1999 | C.K.

We are having a process related problem with pullup resistors on a controller card which has a I960 micro-processor. The controller monitors signal inputs and it's own resources then blinks a LED to indicate its working. The problem is that after

Electromigration Testing

Electronics Forum | Wed Sep 15 17:13:53 EDT 2004 | GS

Do anyone of you know if are there any Standard (IPC, JEDEC, etc) telling how much can be the acceptable level of TIC (ugr/cm2 NaCl equivalent) allowed on surace of Connectors, Components,before to be assembled on PCB ? Many thanks Rgds GS

Industry News: pcb electromigration (21)

Call for Participation Issued for IPC Printed Circuits Expo/APEX Joint Technical Conference

Industry News | 2003-05-01 08:15:48.0

Will take place February 23-27, 2004, at the Anaheim Convention Center in Anaheim, Calif.

Association Connecting Electronics Industries (IPC)

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2014 in Las Vegas

Industry News | 2013-09-26 18:03:10.0

IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test, March 25–27, 2014 at the Mandalay Bay Convention Center, Las Vegas, Nevada.

Association Connecting Electronics Industries (IPC)

Technical Library: pcb electromigration (12)

A Review of Models for Time-to-Failure Due to Metallic Migration Mechanisms

Technical Library | 2009-10-14 21:17:47.0

Electrochemical migration (ECM) is defined as the growth of conductive metal filaments across a printed circuit board (PCB) in the presence of an electrolytic solution and a DC voltage bias. ECM, also known as dendritic growth, is a critical issue in the electronics industry because the intermittent failure behavior of ECM is a likely root-cause of the high occurrence of field failures identified as no trouble found (NTF)/could not duplicate (CND)

DfR Solutions

Instrumentation for Studying Real-time Popcorn Effect in Surface Mount Packages during Solder Reflow

Technical Library | 2014-06-12 16:40:19.0

Occurrence of popcorn in IC packages while assembling them onto the PCB is a well known moisture sensitive reliability issues, especially for surface mount packages. Commonly reflow soldering simulation process is conducted to assess the impact of assembling IC package onto PCB. A strain gauge-based instrumentation is developed to investigate the popcorn effect in surface mount packages during reflow soldering process. The instrument is capable of providing real-time quantitative information of the occurrence popcorn phenomenon in IC packages. It is found that the popcorn occur temperatures between 218 to 241°C depending on moisture soak condition, but not at the peak temperature of the reflow process. The presence of popcorn and delamination are further confirmed by scanning acoustic tomography as a failure analysis.

WASET - World Academy of Science, Engineering and Technology

Express Newsletter: pcb electromigration (818)

SMTnet Express June 13 - 2013, Subscribers: 26140

SMTnet Express June 13, 2013, Subscribers: 26140, Members: Companies: 13397, Users: 34803 Electromigration damage mechanics of lead-free solder joints under pulsed DC: A computational model by: Wei Yao, Cemal Basaran; Electronic Packaging

Partner Websites: pcb electromigration (10)

Advantages and Disadvantages of Different Surface Treatments of PCB

| https://www.nextpcb.com/blog/advantages-and-disadvantages-of-different-surface-treatments-of-pcb

Advantages and Disadvantages of Different Surface Treatments of PCB help General File Requirements Language 0 Account Login Sign up New Customer Get

Call for Participation: Technical Paper - IPC APEX EXPO 2021

| https://ipcapexexpo.org/education/call-for-technical-paper-form

Extreme Requirements PCB Fabrication and Materials Quality, Reliability, Test and Inspection Other Assembly Processes Topics BTC/QFN/LGA Assembly Challenges Cleaning Coating Processes Electronics

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