Electronics Forum | Fri Jul 30 09:43:44 EDT 1999 | C.K.
We are having a process related problem with pullup resistors on a controller card which has a I960 micro-processor. The controller monitors signal inputs and it's own resources then blinks a LED to indicate its working. The problem is that after
Electronics Forum | Wed Sep 15 17:13:53 EDT 2004 | GS
Do anyone of you know if are there any Standard (IPC, JEDEC, etc) telling how much can be the acceptable level of TIC (ugr/cm2 NaCl equivalent) allowed on surace of Connectors, Components,before to be assembled on PCB ? Many thanks Rgds GS
Industry News | 2003-05-01 08:15:48.0
Will take place February 23-27, 2004, at the Anaheim Convention Center in Anaheim, Calif.
Industry News | 2013-09-26 18:03:10.0
IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test, March 25–27, 2014 at the Mandalay Bay Convention Center, Las Vegas, Nevada.
Technical Library | 2009-10-14 21:17:47.0
Electrochemical migration (ECM) is defined as the growth of conductive metal filaments across a printed circuit board (PCB) in the presence of an electrolytic solution and a DC voltage bias. ECM, also known as dendritic growth, is a critical issue in the electronics industry because the intermittent failure behavior of ECM is a likely root-cause of the high occurrence of field failures identified as no trouble found (NTF)/could not duplicate (CND)
Technical Library | 2014-06-12 16:40:19.0
Occurrence of popcorn in IC packages while assembling them onto the PCB is a well known moisture sensitive reliability issues, especially for surface mount packages. Commonly reflow soldering simulation process is conducted to assess the impact of assembling IC package onto PCB. A strain gauge-based instrumentation is developed to investigate the popcorn effect in surface mount packages during reflow soldering process. The instrument is capable of providing real-time quantitative information of the occurrence popcorn phenomenon in IC packages. It is found that the popcorn occur temperatures between 218 to 241°C depending on moisture soak condition, but not at the peak temperature of the reflow process. The presence of popcorn and delamination are further confirmed by scanning acoustic tomography as a failure analysis.
SMTnet Express June 13, 2013, Subscribers: 26140, Members: Companies: 13397, Users: 34803 Electromigration damage mechanics of lead-free solder joints under pulsed DC: A computational model by: Wei Yao, Cemal Basaran; Electronic Packaging
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