Electronics Forum | Tue Apr 09 18:29:34 EDT 2002 | davef
Any-Layer Interstitial Via Hole (ALIVH). In printed circuit board fabrication, a registered mark of Matsushita Electric for a filled microvia structure in all layers for applications requiring small-size, lightweight build-up PWB to achieve high-den
Electronics Forum | Wed Jan 13 04:27:00 EST 2016 | crystalpcb
Hi Here is our factory production capability: Shenze Electronic PCB Specification Layer Count 1 to 35 Layers Material Brand Shengyi,KB,GRACE,ISOLA,Rogers,Taconic,ARLLON,Bergquist Base Material FR-4（TG135,TG150,TG170,TG180），Halogen Free FR-4，Ceramic
Electronics Forum | Wed Sep 11 10:48:02 EDT 2013 | gregp
Hi Reese, The UIC machine is (was) good for higher volumes. Do you think these machines are less appropriate for smaller lot sizes and PCB's with just a few through hole parts? Also, are the UIC through hole machines still fully supported with ampl
Electronics Forum | Mon Sep 09 16:29:56 EDT 2013 | gregp
Hi Everyone, I'm looking for some feedback about through hole assembly requirements today vs. yesteryear. As I see it, there are two main categories...legacy through hole and new through hole with mixed technology. The legacy stuff is older designs
Electronics Forum | Wed Sep 11 15:12:02 EDT 2013 | rway
"Do you think these machines are less appropriate for smaller lot sizes and PCB's with just a few through hole parts?" That depends. It will still save time if your lot sizes are small, as opposed to hand placement. I would not recommend buying an
Electronics Forum | Tue Mar 17 09:06:25 EST 1998 | Justin Medernach
| | Hi all, | I would like to have some information regarding the paste in holes process.We are the Backplane manufacturing and dealing with lots of thick PCB and would like to change the processes from wave to paste in hole.Any feed back of info
Electronics Forum | Thu Sep 12 15:51:29 EDT 2013 | gregp
Hi Dean, Thanks for the feedback. I suppose I should reveal the nature of my query. Contact Systems was founded by my father back in 1970. I worked there from 1983 until we closed the doors back in 2009. I acquired the assets and intellectual pro
Electronics Forum | Mon Nov 17 13:43:39 EST 2014 | gregp
So we all know through hole assembly hasn't been completely eradicated. I am doing some research as to the types of through hole assembly that still remain. My questions are related to through hole requirements and past, current and future methodol
Electronics Forum | Tue Mar 17 13:11:58 EST 1998 | ETS, LLC
ETS (Energy Technology Systems) is a manufacturer of Solder Reflow and Curing Ovens for the Electronics Industry. We offer a specially configured oven designed for processing of Pin in Paste processes as well as double sided mix technology boards. I
Electronics Forum | Wed Nov 19 15:48:48 EST 2014 | gregp
Thank You Adam...this is the type of input I am looking for. To summarize, you are an OEM that has gone through the process to remove most through hole parts from your assemblies. Those that remain are primarily connectors which may not require lea
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