Electronics Forum | Thu Nov 01 04:52:50 EST 2001 | wbu
Hi Brian, yes that�s possible due to the presence of Au in the joint but nothing to worry if the Ni/Au is done properly (means not to much Au in your plating). "rugged" I haven�t noticed yet, that may depend on the definition and maybe the magnifica
Electronics Forum | Sat Oct 02 03:27:52 EDT 1999 | Brian
| I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: | | 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Irons at
Electronics Forum | Sat Oct 02 20:19:19 EDT 1999 | John Dwinell
| | I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: | | | | 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Ir
Electronics Forum | Thu Apr 14 12:33:30 EDT 2005 | russ
Have you checked the component height in the package data to ensure that it is the same? how about the PCB itself, could there be some warp or twist thay may cause the component to be dropped onto the board? any support problems? this is all I can
Electronics Forum | Fri Jul 29 19:12:30 EDT 2005 | Jason Fullerton
In the true sense of the term, tombstoning can only occur during reflow. Now, if your solder joints are cracking during thermal cycling and opening on one end you still have a problem - it just isn't "tombstoning". What laminate are you using on yo
Electronics Forum | Thu Aug 17 08:44:14 EDT 2000 | Wolfgang Busko
Hi Jaqueline, my first thought goes into the same direction, twist or warp (either the board or the BGA itself). I don�t know the SRT equipment. I�ve noticed with our equipment using a spot underheat element caused some warpage of the PCB making it
Electronics Forum | Fri May 04 18:27:34 EDT 2001 | chpark
BGA warpage combined with PCB warpage can lead significant process yield loss. First, it is possible that major portion of BGA's apparent warpage is, in fact, coming from the PCB warpage. Assuming that the warpage is solely from BGA itself, I think
Electronics Forum | Thu Mar 25 09:14:09 EDT 2010 | krish_bala
Hello, I have been having some troubling issues when it has come to BGA Placement and I was hoping if there have been others who have been able to resolve similar issues. We are curently doing reworks on a variety of BGA, but seem to be having issu
Electronics Forum | Thu Jun 28 16:55:45 EDT 2007 | hegemon
Hey Brian, Did you use the auto profile feature on your DRS25 machine to arrive at your profile? Our DRS25 has been doing quite well at larger BGA components. Most critical is a good preheat until the PCB reaches at least 140c, followed by a 2degC
Electronics Forum | Fri Jun 15 22:00:23 EDT 2007 | grantp
Hi, Thanks for the reply guys, and this is interesting information. I had assumed that if we had a paste spec, and this was the spec for the solder to reflow correctly, then if I achieved that spec, the solder should perform correctly. However this
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