Electronics Forum | Wed Nov 17 11:03:11 EST 2004 | Haran
We are looking for a Inspection house in China to perform Inspection and Sorting on PCBA manufacturing process and product at various MNC.
Electronics Forum | Thu Nov 18 18:49:24 EST 2004 | Haran
We are looking for a Inspection house in China to perform Inspection and Sorting on PCBA manufacturing process and product at various MNC's. Well verse with IPC requirement.
Electronics Forum | Wed Mar 12 07:33:40 EDT 2008 | callckq
Hi All, One PCBA failed test after went through the Shock Test(Vibration) and suspected to be BGA solder ball crack. We performed dye and pry and found PCB's pad lifted with red mark ink penetrate pad underneath, what does this mean? Can I say the
Electronics Forum | Fri Mar 26 15:17:30 EDT 2010 | jooh
Thanks for your replies! So what I understand is that ICT in reality is "only" a production process safety net, but it's a net that in most practical cases is needed. What ICT can not catch is (all) bad solder joints. What are the methods to find t
Electronics Forum | Fri Mar 26 11:31:34 EDT 2010 | rway
I have been using ICT for a number of years. It is still a viable resource for catching defects in the production process. AOI doesn't catch everything, such as bridging on QFN or J-lead devices (this will depend on the type of AOI and camera syste
Electronics Forum | Mon Mar 29 12:10:14 EDT 2010 | rway
Test Jet will work for catching lifted leads, certainly. X-ray is the only thing for testing for internal solder defects such as voids and cracks. I personally do not have any experience using X-ray, so I cannot advise on its reliability. Perhaps
Electronics Forum | Tue Apr 09 21:40:26 EDT 2002 | ianchan
We are a local enterprise with limited resources, just like you described, so hope this experience sharing helps : we place a production Visual Mechanical Inspection (VMI) inspector at the end of each Reflow Oven area, complete with magnify scope 30
Electronics Forum | Mon Jul 17 15:35:09 EDT 2017 | svfeingold
Evtimov, I thank you for your response. I posted a thread about this on EEVBlog but there is less experience there for this type of equipment it would seem. If your interested there's a lot more detail about what I'm after: http://www.eevblog.com/for
Electronics Forum | Wed Apr 06 12:21:14 EDT 2011 | ripper
Hi, I am process engineer in PCBA factory.I have a question about gold plating on BGA.I want to know difference soldering performance between gold plating electrolytic and ENIG.Many thank for any idea.
Electronics Forum | Tue Nov 25 16:26:43 EST 2003 | tdurston
We are trying to establish requirements and process controls for completed, cleaned SMT assemblies. We have problems with our high impedance circuits (100 meg ohms) being affected by residue. Some boards require additional cleaning cycles to remove
