| https://www.eptac.com/wp-content/uploads/2007/10/webinar_eptac_10_17_07.pdf
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_10_17_07.pdf
| http://etasmt.com/cc?ID=te_news_industry,3561&url=_print
. Ni-Pd as an alternative lead-free solder was introduced by Texas Instruments to the semiconductor industry in 1989. Since then, TI has shipped millions of units that used this "lead-free" lead finish material
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5246
The Role of Nickel in Solder Alloys - Part 2. The Effect of Ni on the Integrity of the Interfacial Intermetallic in Sn-Based/Cu Substrate Solder Joints 中文
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
. The Effect of Ni on The Integrity of The Interfacial Intermetallic in Sn-Based Solder Joints to Copper Substrates ." (Co-authors: Keith Sweatman and Tetsuro Nishimura
| http://etasmt.com/te_news_industry/2013-03-29/3561.chtml
. Ni-Pd as an alternative lead-free solder was introduced by Texas Instruments to the semiconductor industry in 1989. Since then, TI has shipped millions of units that used this "lead-free" lead finish material
| http://etasmt.com:9060/te_news_industry/2013-03-29/3561.chtml
. Ni-Pd as an alternative lead-free solder was introduced by Texas Instruments to the semiconductor industry in 1989. Since then, TI has shipped millions of units that used this "lead-free" lead finish material
| https://pcbasupplies.com/alloy-solder-paste-enig/
. Recommended for ENIG finish In ENIG finish, Sn-Ni IMC layer thickens and along with concentration of P causes the joint interface brittle.By adding Ni-compatible Cu, SB6NX forms a Ni barrier layer and effectively prevents the thickening of Sn-Ni IMC layer, realizing high joint reliability with ENIG finish
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
Adhesives Geoff Rivers, Pearl Lee-Sullivan, Boxin Zhao, Alex Chen, John Persic and Robert Lyn Abstract 30-3 Solder Ball Joint Reliability with Electroless Ni/Pd/Au Plating -Influence of Electroless Pd
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/news/nordson-march-research-evaluates-the-effects-of-rf-plasma-processing-prior-to-conformal-coating
(formerly known as Desich SMART Center). The paper can be downloaded here . The objective of the experiment was to evaluate the effects of RF plasma processing on the conformity of coverage of conformal coating of the knee of individual Nickel-Palladium-Gold (Ni-Pd-Au
