We are a premier TAPE AND REEL service. We have extensive capabilities for your SMT and Through Hole components. Also I.C. PROGRAMMING including flash memory. First articles provided free of charge.
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Best-in-class thermal performance and improved sustainability, meeting the most critical and demanding reflow requirements in the industry. The Centurion™ reflow soldering oven is a forced-convection SMT reflow system with tight, closed-l
Electronics Forum | Thu Mar 09 12:31:46 EST 2006 | jsloot
I am experiencing peel back problems when a particular component is used on a Meridian 1010 and 1020P machine. I would like to start testing this force but I need some more info. Besides GPD who else makes a tester? What industry standards can I refe
Year 2008 - Like New Condition Tyco SEP 3T Shuttle Electric Press Standalone electric press for the application of PCBs onto compliant pin housings or connectors • Servo electric press with shuttle system for product location under press ram • Ho
WATCH our machines in action NOW on our website under VIDEOS Universal GSM1 from prototype lab. Not used in production. Outstanding mint condition, like new. Used very little. Some features include: * P Block * 4 Spindle C4 Flex Head W/ H
Industry News | 2021-11-08 14:38:39.0
Heller Industries, a leading supplier of reflow soldering ovens for electronic manufacturing and pressure curing ovens for back-end semicondutor manufacturing, today announced they will be exhibiting their new MK7 reflow oven at the San Diego Conference Center January 25-27, 2022.
Industry News | 2016-02-27 22:07:08.0
GPD Global will exhibit in Booth#1818 at the upcoming IPC APEX EXPO 2016 Conference and Exhibition. See a live demonstration of 01005 dispensing on the MAX series high precision dispenser, the intuitively programmed Island series benchtop dispenser, and a full range of dispense pumps used on GPD dispense systems.
This splice tape is used for jointing carrier tapes in the SMT process, It is made of 2 silver tapes and release paper. Size: 8mm, 12mm, 16mm, 24mm Main Characteristic 1, Peeling-off force(N/25mm)by angle of 180 degree. 2,Retaining(H/25*25mm)
CNSMT AGGGC8105 Dispersion Plate CNSMT AGGGC8105 Dispersion Plate KHY-M7152-01 KHY-M7153-00 AME05-E2-34W JA10AA-21W solenoid valve KHY-M7106-B0 A0 KKY-M7106-A0 Yamaha placement machine nozzle rod set KHY-M652H-01 Yamaha mounter YG12 YS12 YS24
Technical Library | 2013-08-13 09:49:53.0
One of the common issues I’ve noticed when visiting shops that use crimp force monitors (CFMs) is that the CFMs are usually turned off, regardless of the brand, because engineers and operators are not using them properly. Why, with all of their benefits, are CFMs not being used regularly by employees? One of the biggest problems is the lack of understanding of the variables affecting the CFM’s ability to detect variations. Crimp quality detection is similar to baking a cake. There are a lot of ingredients and if one ingredient is missing or of bad quality, you likely are not going to achieve your desired result. This article will go back through the basics of a crimp quality detection system and discuss what ingredients or variables you need to consider before switching off that CFM.
Technical Library | 2019-05-15 22:26:02.0
As the demand for higher routing density and transfer speed increases, Via-In-Pad Plated Over (VIPPO) has become more common on high-end telecommunications products. The interactions of VIPPO with other features used on a PCB such as the traditional dog-bone pad design could induce solder joints to separate during the second and thereafter reflows. The failure has been successfully reproduced, and the typical failure signature of a joint separation has been summarized.To better understand the solder separation mechanism, this study focuses on designing a test vehicle to address the following three perspectives: PCB material properties, specifically the Z-direction or out-of-plane Coefficient of Thermal Expansion (CTE); PCB thickness and back drill depth; and quantification of the driving force magnitude beyond which the separation is due to occur.
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
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Micro-mechanical Tests Compression test Creep test Connectors Solder fatigue test Flexural test Hot bump pull Ribbon peel Torsion test Back To Top Nordson DAGE is a market leading provider of award
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