New Equipment | Solder Materials
Easily Reball BGA components for as little as a penny each. No solder paste required. Re-Ball components using our water wash tacky flux. No more expensive and hard to order solder pre-forms. Call (888) 406-2830
BRASS FENDER WASHERS DIN 9021 DIN 522 Brass Washers Din 9021 Size d1 min d2 max s Packing M3 3.2 9 0.8 100 M4 4.3 12 1 100 M5 5.3 15 1.2 100
Electronics Forum | Mon May 09 18:14:54 EDT 2016 | davef
I asked Randi Gates, Electrolube Marketing to join us to help with the conversation. Taking a step back from the Electrolube question, I could envision a 10 minute soak in DI water stripping the gold from a an ENIG board, you know, depending on the
Electronics Forum | Thu Jun 22 14:04:03 EDT 2000 | John Thorup
Hi Jason - I'll second (third?) everything said. Wassink's bible is available in the US from the SMTA bookstore with free shipping. It's pricey but worth every penny. 612/920-7682 www.smta.org jesse@smta.org John Thorup
Industry News | 2022-09-14 10:59:44.0
XDry Corp. has extended its warranty. In celebration of its upcoming 15-year anniversary, the company is offering a three-year parts warranty on all new purchases.
Industry News | 2022-09-21 08:23:51.0
XDry Corp. will exhibit at the SMTA Long Island Expo & Tech Forum with its representative PIT Equipment Services. The event is scheduled to take place Wednesday, Oct. 19, 2022 at the Marriott Melville in New York.
Technical Library | 2017-02-09 17:08:44.0
The SMT assembly world, especially within the commercial electronics realm, is dominated by no-clean solder paste technology. A solder paste flux residue that does not require removal is very attractive in a competitive world where every penny of assembly cost counts. One important aspect of the reliability of assembled devices is the nature of the no-clean solder paste flux residue. Most people in this field understand the importance of having a process that renders the solder paste flux residue as benign and inert as possible, thereby ensuring electrical reliability.But, of all the factors that play into the electrical reliability of the solder paste flux residue, is there any impact made by the age of the solder paste and how it was stored? This paper uses J-STD-004B SIR (Surface Insulation Resistance) testing to examine this question.
