New SMT Equipment: permittivity (1)

High Frequency PCB

High Frequency PCB

New Equipment | Assembly Services

High Frequency PCB Material: SYTECH Layer Count: 4 layers PCB Thickness: 1.6mm Min. Trace / Space Outer: 0.1mm/0.1mm Min. Drilled Hole: 0.2mm Via Process: Tenting Vias Surface Finish: ENIG+OSP Product Features 1. DK needs to be tiny as well

NextPCB-Reliable Multilayer Boards Manufacturer

Electronics Forum: permittivity (1)

PCB Trouble shooting Lab

Electronics Forum | Tue Apr 17 09:38:04 EDT 2001 | CAL

With some help from our good Friends at Agilent Technologies our RF Lab includes testing up to 100GHz. Equipment includes Vector network analyzer, signal analyzer, dual channel power meter, noise filter meter, advanced impedance analyzer (including

Industry News: permittivity (2)

New A Revision of IPC-4202 Gives Updated Guidance in Flexible Base Dielectric Materials

Industry News | 2010-04-23 22:01:16.0

BANNOCKBURN, Ill. IPC - Association Connecting Electronics Industries® has released IPC-4202A, Flexible Base Dielectrics for Use in Flexible Printed Circuitry. This document provides comprehensive data to help users more easily determine the capability and compatibility of flexible base dielectric materials in manufacturing flexible printed circuitry and flexible flat cables.

Association Connecting Electronics Industries (IPC)

Raw Material Choices for PCBs

Industry News | 2018-10-18 11:10:33.0

Raw Material Choices for PCBs

Flason Electronic Co.,limited

Technical Library: permittivity (17)

Round Robin of High Frequency Test Methods by IPC-D24C Task Group

Technical Library | 2017-06-29 16:39:30.0

Currently there is no industry standard test method for measuring dielectric properties of circuit board materials at frequencies greater than about 10 GHz. Various materials vendors and test labs take different approaches to determine these properties. It is common for these different approaches to yield varying values of key properties like permittivity and loss tangent. The D-24C Task Group of IPC has developed this round robin program to assess these various methods from the "bottom up" to determine if standardized methods can be agreed upon to provide the industry with more accurate and valid characteristics of dielectrics used in high-frequency and high-speed applications.

DuPont

Improving Density in Microwave Multilayer Printed Circuit Boards for Space Applications

Technical Library | 2013-11-27 16:54:01.0

The need in complexity for microwave space products such as active BFNs (Beam Forming Networks) is increasing, with a significantly growing number of amplitude / phase control points (number of beams * numbers of radiating elements). As a consequence, the RF component’s package topology is evolving (larger number of I/Os, interconnections densification ...) which directly affect the routing and architecture of the multilayer boards they are mounted on. It then becomes necessary to improve the density of these boards (...) This paper will present the work performed to achieve LCP-based high density multilayer structures, describing the different electrical and technological breadboards manufactured and tested and presenting the results obtained.

THALES

Express Newsletter: permittivity (2)


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