Technical Library: peter (Page 1 of 3)

DA-1200 THT automated inspection system service report

Technical Library | 2020-03-24 23:34:07.0

Installing time : November 24 to December 2 ,2019 Participants: Customer from (Elaraby , Egypt) Service engineer:Peter (1 Click SMT)

1 CLICK SMT TECHNOLOGY CO., Limited

1Click SMT Made Successful Installation and Training For Thai Customer!

Technical Library | 2020-04-01 05:52:59.0

Recently, our engineer Peter went to Thailand to provide after-sales support for our customer. In these days, we had installed a SC-900 selective coating line . Moreover, Peter gave patience and meticulous training to their staff, make sure they master the machine usage .Customer and agent are satisfied with our support and give their affirmation to us. SC-900 is a high Performance 4 axis Selective Coating Machine ,which is equipped with high precision servo control system , various valves , CCD system ,material tank weight detecting system etc, which can provide a high efficiency conformal coating process .The maximum coating size can reach 400mm*450mm with SC-900. So far, we've installed several dozen conformal coating line all over the world. It have excellent stability and performance. Check below link to get more info!

1 CLICK SMT TECHNOLOGY CO., Limited

three knives led strips cutting machine

Technical Library | 2019-05-13 04:05:15.0

For the customers of LED lamp industry, LED board splitter is indispensable. Our machine is cheap, light weight and cutting speed is 500 mm per second. email:s1@hk-yush.com

YUSH Electronic Technology Co.,Ltd

Fundamentals of Capillary Ion Chromatography

Technical Library | 2021-04-29 01:49:47.0

In this work, we highlight the fundamental differences between conventional IC (4 mm and 2 mm) and Capillary Ion Chromatography.

Thermo Fisher Scientific

SnCu Based Alloy Design for Lower Copper Dissolution and Better Process Control

Technical Library | 2009-02-13 12:29:39.0

To meet the market demand for a best-in-class, low-cost leadfree alloy for wave, selective and dip soldering

Kester

Total Loss: How to Qualify Circuit Boards

Technical Library | 2011-05-12 19:04:05.0

We clarify the role of signal loss measurements, aka Total Loss, in specifying and qualifying circuit board materials for high-speed electronic design. We then demonstrate the NIST Multiline measurement technique in particular by characterizing test line

Connected Community Networks, Inc.

Environmental Compliance Reporting - Mastering a Moving Target

Technical Library | 2012-05-17 21:53:39.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. Companies that have initiated internal resources to obtain compliance data have realized that collecting, and more importantly, maintaining the currency of that data requires more

Total Parts Plus

Lead-free SMT Soldering Defects How to Prevent Them

Technical Library | 2012-10-23 14:25:38.0

Tin-Silver-Copper alloys are the primary choice for lead-free SMT assembly. Although there are other options available such as alloys containing bismuth or indium and other elements, tin-silver-copper solders, also known as SAC alloys are by far the most popular. They are used by approximately 65% of users, as last surveyed by Soldertec in 2003.

Kester

Effects of Assebly Process Variables on Voiding at a Thermal Interface.

Technical Library | 2007-04-04 11:43:41.0

The present work offers a discussion and a first case study to identify and illustrate voiding mechanisms for a particular TIM between a heat spreader and the back of a flip chip. Pronounced differences were observed between stencil printing and dispensing in terms of initial void formation, apparently related to the specific properties of the material. Measurements of the effects of heat ramp rate and peak temperature showed the subsequent evolution and final void size distribution to be determined by the initial part of the cure profile up to the material gelling temperature.

Universal Instruments Corporation

Lead-free and Tin-lead Assembly and Reliability of Fine-pitch Wafer-Level CSPs

Technical Library | 2007-05-31 19:05:55.0

This paper discusses solder paste printing and flux dipping assembly processes for 0.4 and 0.5mm pitch lead-free WLCSPs and the corresponding assembly results and thermal cyclic reliability obtained. Variables evaluated include reflow ambient, paste type, and stencil design. Reliability is also compared to results for the same components assembled under identical conditions using SnPb solder.

Universal Instruments Corporation

  1 2 3 Next

peter searches for Companies, Equipment, Machines, Suppliers & Information

Selective soldering solutions with Jade soldering machine

Reflow Soldering 101 Training Course
Equipment Auction - Eagle Comtronics: Low-Use Electronic Assembly & Machining Facility 2019 Europlacer iineo + Placement Machine  Test & Inspection: Agilent | Tektronix | Mantis Machine Shop: Haas VF3 | Haas SL-20 | Mult. Lathes

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Equipment Auction - Eagle Comtronics: Low-Use Electronic Assembly & Machining Facility 2019 Europlacer iineo + Placement Machine  Test & Inspection: Agilent | Tektronix | Mantis Machine Shop: Haas VF3 | Haas SL-20 | Mult. Lathes

World's Best Reflow Oven Customizable for Unique Applications