Philips GEM Feeders 1.Philips CL 8x2mm Feeder KW1-M1300-020 2.Philips GEM 08x02 Feeder PA2903/74 3. Philips GEM 8mm Feeders PA2903/79 4. Philips GEM 12mm Feeders PA2903/ 5. Philips GEM 16mm Feeders Variable Pitch 6. Philips GEM 24mm Feeders PA2
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Electronics Forum | Fri Mar 07 04:53:12 EST 2008 | vinitverma
Hi Wayne, First, all Gem machines including Topaz, TopazX, Sapphire, etc... have the same feeders. You can use either FV feeders (which were the ones when Topaz was introduced), or CL feeders (which came when Topaz X was introduced). Both types of f
Electronics Forum | Wed May 30 18:35:04 EDT 2001 | Robert.Culpepper@Transcore.com
Were not placing 0402s nor do we have a Sapphire. We are placing 0603's with both the Topaz and Emerald though without any problems. I would like to ask you if you are using any programming software for CAD conversions such as PPS or Unicam and your
Detailed Product Description Part Name: Calibration Kit Part Number: KM0-M88C0-10X, 5322 395 10825 Machine: Yamaha, Assembleon Condition: New Origin: China Lead Time: Within 1~3days After Payment 5322 395 10825 PA 1912100 Calibration kit Glass ad
philips CL72mm Feeder Part Name：philips CL72mm Feeder Assembleon/philips/yamaha EMERALD-X(i), EMERALD-X(i)II & YV88X / YV88XG，FCM, FCM-2，Topaz, Emerald & YV100II/YVL88，Sapphire, Comet, YV112，Topaz-X(i), Topaz-X(i)II, Opal-X II, Sapphire-X II & YV10
Technical Library | 2020-04-14 16:00:20.0
The number of through hole connections on a circuit assembly are decreasing with the drive toward miniaturization. When these assemblies are manufactured in high volumes the most convenient method is selective soldering. Although selective soldering is very well introduced in automotive and industrial applications it can also be a very efficient method to solder high volume consumer products.
Technical Library | 2013-08-22 14:28:58.0
Tin-rich solders are widely applied in the electronic industry in the majority of modern printed circuit boards (PCBs). Because the use of lead-tin solders has been banned in the European Union since 2006, the problem of the bridging of adjacent conductors due to tin whisker growth (limited before by the addition of Pb) has been reborn. In this study tin alloys soldered on glass-epoxy laminate (typically used for PCBs) are considered. Scanning ion microscopy with Focused Ion Beam (FIB) system and energy-dispersive X-ray spectroscopy (EDXS) were used to determine correlations between spatial non-uniformities of the glass-epoxy laminate, the distribution of intermetallic compounds and whisker growth.
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