DOCTAR is used validate design changes throughout the hardware board design and manufacturing lifecycle. DOCTAR analyzes changes to both to physical and logical elements in the design database. Test point analysis includes test points that have b
DOCTAR is used validate design changes throughout the hardware board design and manufacturing lifecycle. DOCTAR analyzes changes to both to physical and logical elements in the design database. Test point analysis includes test points that have b
Industry News | 2012-07-12 10:34:27.0
The SMTA announced that it will have a Package-on-Package (PoP) Design and Assembly Center during their annual conference, SMTA International, taking place October 14-18, 2012 in Orlando, Florida.
Industry News | 2012-07-12 10:34:54.0
The SMTA announced that it will have a Package-on-Package (PoP) Design and Assembly Center during their annual conference, SMTA International, taking place October 14-18, 2012 in Orlando, Florida.
Technical Library | 2021-12-16 01:48:41.0
Package-on-Package (PoP) technology is widely used in mobile devices due to its simple design, lower cost and faster time to market. Warpage characteristic and requirement of PoP package becomes critical to ensure both the top and bottom package can be mounted with minimal yield lost. With this challenge in placed, iNEMI has been working relentlessly to fingerprint the current PoP package technology warpage characteristic and to establish some key learning for packaging technologies. The work also extended to understand the basic requirement needed for successful PoP stacking by analyzing the warpage data obtained and formulate a simple analytical equation to explain the true warpage requirement for PoP packaging.
Technical Library | 2014-08-19 16:04:28.0
SMT assembly planning and failure analysis of surface mount assembly defects often include component warpage evaluation. Coplanarity values of Integrated Circuit packages have traditionally been used to establish pass/fail limits. As surface mount components become smaller, with denser interconnect arrays, and processes such package-on-package assembly become prevalent, advanced methods using dual surface full-field data become critical for effective Assembly Planning, Quality Assurance, and Failure Analysis. A more complete approach than just measuring the coplanarity of the package is needed. Analyzing the gap between two surfaces that are constantly changing during the reflow thermal cycle is required, to effectively address the challenges of modern SMT assembly.
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/electronics-assembly-and-packaging?con=t&page=2
: Electronics - Assembly and Packaging ISTFA 2021 Nordson SONOSCAN Come join us at ISTFA (Booth #909) at the Phoenix Convention Center. Webinars Nordson SONOSCAN Acoustic Microscopy Free Webinars Custom Systems Nordson SONOSCAN Sonoscan Technology, Your Specifications. D9650 C-SAM®
1st Place Machinery Inc. | http://www.firstplacemachinery.com/smt_pcb_pic_place_philips.html
(5 bar like 7CFM) On a skid ready to ship Good Condition - Start up and Run Location: Phoenix, Arizona Price: $20,000 USD Philips Comet II Pick and Place Machine Package See more photos below Previous Page Home SMT & PCB Equipment
