Industry News | 2016-03-14 05:03:19.0
We have written two eBook’s Guide to Pin In Hole Intrusive Reflow Design and Assembly and Package On Package Design and Assembly, both are available to download free of charge
Industry News | 2020-02-11 04:22:16.0
Providing process information and solving process defects is what I have been doing for many years with different organisations. In addition we have in the past created reports on 0201 assembly and testing of PCB surface finishes for lead-free assembly
Industry News | 2015-05-24 10:37:43.0
Having produced the first book, video and interactive CD-ROM on pin in hole intrusive reflow we believe we are in a good position to help engineers achieve better yields and implement high and low temperature processes with our next PIHR webinar http://www.bobwillisonline.com/training_detail.asp?WorkshopID=129
Industry News | 2017-04-13 06:06:32.0
Solderability Benchmarking, Failures & Testing Methods 14th August All our webinars are based on 2.30pm UK time go to https://www.bobwillis.co.uk/events/ Benchmarking you PCB surface finish or the impact of baking boards or components can be simple in production and the laboratoy. Long term solderability of component terminations and printed circuit boards is fundamental in modern assembly processes. This is all practical experience not just theory for the presenters countless studies in industry
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