Nextreme designs and manufactures manufactures micro-scale electronics cooling and energy harvesting solutions for telecommunications, semiconductor, consumer, medical, aerospace and government markets.
Industry Directory | Manufacturer
Pillarhouse is a leading supplier of selective soldering systems for single-point and multi-point soldering configured for manual loading, in-line or as multiple unit in-line systems offering topside and in-line preheat.
An offline process programming system Allows easy creation of flux, pre-heat and solder joints and baths Produces graphical representations of the PCB Solder nozzles shown as actual size Uses industry standard Gerber Data 90% of the programmin
Cost effective Nitrogen generating systems The PillarGEN Nitrogen generation system has been specifically designed to meet the Nitrogen supply requirements of the current range of Pillarhouse selective soldering systems. The latest Nitrogen generati
Electronics Forum | Sat Oct 22 13:37:46 EDT 2016 | greglac
I am currently working on a custom IC where we plan on using Cu pillars at 80um pitch. I'm am trying to narrow down a packaging solution. My requirements are as follows: 40um Line Width/Space Capability (or finer) 4 layers low loss at mm-wave
Electronics Forum | Mon Jan 28 00:48:21 EST 2002 | peterson
Being in the backplane biz, we too, encounter similar problems...especially when our customer reads the IPC as Biblical (you will achieve 75% fill or be turned into a pillar of salt). Anyway, recently, one of our process engineers suggested paste-hol
Used SMT Equipment | Soldering - Selective
Pillarhouse Jade MKII Selective Soldering Machine Model: Jade MKII Year: 2016 Lead-Free Drop Jet Fluxer Top Side IR Pre-Heat Auto Soler Top-Up & Solder Level Detect Inerted Nitrogen System Thermal Nozzle Calibrati
Used SMT Equipment | Soldering - Selective
• Dual Pot Lead/Leadfree • Drop Jet Fluxed • Inerted Nitrogen System • One AP Solder tips • PillarCOMM Windows Software • Solder Wire Feeder • Solder Bath Level Sensor • Solder Wave Height Measurement • Black and White Camera Programming • S
Industry News | 2024-01-15 14:07:45.0
The following is a statement by Richard Cappetto, Senior Director, North American Government Relations at IPC, the electronics manufacturing association, on the release of the National Defense Industrial Strategy (NDIS) yesterday by the U.S. Department of Defense. A fuller statement is in this IPC Blog.
Industry News | 2023-10-20 09:49:39.0
In the ever-evolving landscape of PCB (Printed Circuit Board) manufacturing, precision and adaptability stand as the pillars of success. Allow us to introduce the I.C.T-5700 PCB Routing Machine, a technological marvel poised to redefine the industry by enhancing precision and efficiency. This comprehensive article explores the core features, technological innovations, and the substantial benefits that the I.C.T-5700 brings to the forefront.
Parts & Supplies | Assembly Accessories
SC4-M5A SPEED CONTROLLER SC4-M5A SPCON 4 M46-M8527-C0X FILTER 1 SPARE PARTS 2001.02.02 M120012 KW7-M5303-10X SW POWER DC12 1 KW7-M5126-00X SAFETY SWICTH 2 KW7-M13D7-00X SEAL 2(YAMAHA) 1 KW3-M5169-00X MOUSE 1 2002.5 KW3-M5150-11X KEYBOARD E KW
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Parts & Supplies | Pick and Place/Feeders
NXT 8MM scrap with front guide wheel PM066A2 Model: FUJI Mounter Specification: NXT 8MM scrap with front guide wheel PIN Part Number: PM066A2 Name: NXT 8MM scrap with front guide wheel PIN PM08XK3 FUJI NXT special-shaped nut PM066A2 FUJI NXT 8
Technical Library | 2018-01-17 22:47:02.0
Fine pitch copper (Cu) Pillar bump has been growing adoption in high performance and low-cost flip chip packages. Higher input/output (I/O) density and very fine pitch requirements are driving very small feature sizes such as small bump on a narrow pad or bond-on-lead (BOL) interconnection, while higher performance requirements are driving increased current densities, thus assembling such packages using a standard mass reflow (MR) process and maintaining its performance is a real and serious challenge. (...) In this study a comprehensive finding on the assembly challenges, package design, and reliability data will be published. Originally published in the SMTA International 2016
Technical Library | 2015-12-02 18:32:50.0
(Thermal Compression with Non-Conductive Paste Underfill) Method.The companies writing this paper have jointly developed Copper (Cu) Pillar micro-bump and TCNCP(Thermal Compression with Non-Conductive Paste) technology over the last two+ years. The Cu Pillar micro-bump and TCNCP is one of the platform technologies, which is essentially required for 2.5D/3D chip stacking as well as cost effective SFF (small form factor) package enablement.Although the baseline packaging process methodology for a normal pad pitch (i.e. inline 50μm) within smaller chip size (i.e. 100 mm2) has been established and are in use for HVM production, there are several challenges to be addressed for further development for commercialization of finer bump pitch with larger die (i.e. ≤50μm tri-tier bond pad with the die larger than 400mm2).This paper will address the key challenges of each field, such as the Cu trace design on a substrate for robust micro-joint reliability, TCNCP technology, and substrate technology (i.e. structure, surface finish). Technical recommendations based on the lessons learned from a series of process experimentation will be provided, as well. Finally, this technology has been used for the successful launching of the company FPGA products with SFF packaging technology.
Ultra-flexible, offline, multi-platform, quick load twin PCB rotary table selective soldering system Designed to meet the needs of the small batch manufacturer who requires high levels of production flexibility. The Jade Prodex offers the ability to
Ultra-flexible, offline, multi-platform selective soldering system Designed to meet the needs of the small batch manufacturer who requires high levels of production flexibility. The Jade Pro offers the ability to regularly change solder alloys witho
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
HALT Testing of Backward Soldered BGAs on a Military Product Online Version SMTnet Express, December 10, 2015, Subscribers: 23,782, Members: Companies: 14,767, Users: 39,402 Packaging Technology and Design Challenge for Fine Pitch Micro-Bump Cu-Pillar
HALT Testing of Backward Soldered BGAs on a Military Product Online Version SMTnet Express, December 10, 2015, Subscribers: 23,782, Members: Companies: 14,767, Users: 39,402 Packaging Technology and Design Challenge for Fine Pitch Micro-Bump Cu-Pillar
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/bondtesters/vision-systems
. Side Alignment Camera The side view camera is ideal for testing micro features such as copper pillars, micro bumps and TSVs. The system enables a secondary view point of feature to be tested, providing accurateand repeatable tests
Heller Industries Inc. | https://hellerindustries.com/news/heller-attends-ceia-huizhou-seminar/
. Currently, Huizhou has established a modern industrial system called “2+2+N,” with the electronic information and the petrochemical industries as the main pillars, along with development of automotive, equipment manufacturing, and clean energy industries
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