Industry News: pin to pad defects (Page 1 of 14)

MIRTEC to Offer Live Remote Demo of the GENESYS-PIN 3D Pin Inspection System at SMTconnect

Industry News | 2022-04-13 10:22:58.0

MIRTEC will premier its line of 3D AOI and SPI Inspection Systems Hall 4A, Stand 128 at SMTconnect, scheduled to take place May 10-12, 2022 in Nuremberg.

MIRTEC Corp

MIRTEC to Display Award-Winning 3D AOI and SPI Solutions at APEX 2022

Industry News | 2021-12-21 14:45:26.0

MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1122 at the 2022 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place January 25-27, 2022, at the San Diego Convention Center.

MIRTEC Corp

MIRTEC to Exhibit its Complete Line of AI-Based SMT and Automotive Pin Inspection Solutions at Productronica 2021

Industry News | 2021-10-11 16:13:11.0

MIRTEC will showcase its cutting-edge INTELLI-PRO AI Based Smart Factory Automation Solution and GENSYS-PIN Automotive Pin Inspection System in booth #461, Hall A2 at the 2021 Productronica exhibition. The world's largest exhibition for the electronic manufacturing industry will take place on Nov. 16-19, 2021, at Messe Munich exhibition hall in Germany.

MIRTEC Corp

MIRTEC to Display Award-Winning 3D AOI and SPI Solutions at APEX 2023

Industry News | 2022-12-14 12:21:04.0

MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1841 at the 2023 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Jan. 24-26, 2023, at the San Diego Convention Center in California.

MIRTEC Corp

MIRTEC GmbH to Have a Strong Presence at SMTConnect 2023 with 5 Inspection Systems on Display

Industry News | 2023-04-11 09:52:04.0

MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems at SMTconnect, scheduled to take place May 9-11, 2023 in Nuremberg, Germany. The company will showcase a total of five (5) Inspection Systems specifically designed to address the full spectrum of inspection requirements associated with the electronics manufacturing industry in Hall 4A, Stand 128.

MIRTEC Corp

MIRTEC to Display Award-Winning 3D AOI and SPI Solutions at the SMTA Guadalajara Expo 2023

Industry News | 2023-09-25 14:05:43.0

MIRTEC is pleased to announce its participation in the upcoming SMTA Guadalajara Expo on Wednesday, Oct. 25, 2023. The event is scheduled to take place at Expo Guadalajara in Jalisco, Mexico. In Booth 319, MIRTEC will feature a total of four (4) Inspection Systems specifically designed to address the full spectrum of inspection requirements associated with the Electronics Manufacturing Industry:

MIRTEC Corp

Web-based Seminar on Black Pad to Feature Solectron Tech Leaders

Industry News | 2003-03-14 08:18:03.0

The instruction is intended as a practical user's guide for determining if a failure is related to black pad.

Surface Mount Technology Association (SMTA)

IPC Conference to “Clean Up” Reliability Problems

Industry News | 2013-10-28 16:31:54.0

IPC Conference on Solder and Reliability: Materials, Processes and Tests, November 13–14 in Costa Mesa, Calif.

Association Connecting Electronics Industries (IPC)

I.C.T Automated Optical Inspection (AOI) to Improve SMT Line Efficiency

Industry News | 2022-10-12 08:07:17.0

I.C.T Provide SMT Production Line solutions with Automated Optical Inspection (AOI) AOI is short for Automated Optical Inspection, which is widely used in the electronics industry to check the appearance of PCBA assembly at the back end of the circuit board assembly line. The basic principle of AOI is to judge whether the object to be tested meets the standard by comparing whether there is a large difference between the object to be tested and the standard image by using image technology. AOI emits a 4-color light source to the PCBA board, which is automatically scanned by an industrial camera for catastrophic failures, such as missing components or quality defects. Therefore, the quality of AOI depends on the image imaging ability, algorithm parsing ability and image discrimination technology. I.C.T AOI has done well in these aspects.

Dongguan Intercontinental Technology Co., Ltd.

New IPC-9708 Standard Fills the Void in Test Methods for Pad Cratering

Industry News | 2011-03-31 11:54:23.0

Over the past few years, pad cratering has become a vexing problem in lead-free assemblies, largely attributed to problems with the resin used to make a printed board. To help industry eliminate the defect and, at the same time, cut costs, IPC — Association Connecting Electronics Industries® has released IPC-9708, Test Methods for Characterization of PCB Pad Cratering.

Association Connecting Electronics Industries (IPC)

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