Electronics Forum: pitch mismatch (10)

Re: 8 mil placement, part Deaux!! / My Mistake - Sorry

Electronics Forum | Mon Sep 14 09:25:49 EDT 1998 | Dave F

0.050" -> 50 mil -> 50 pitch 0.80 mm -> 0.032" -> 32 mil -> 32 pitch 0.64 mm -> 0.025" -> 25 mil -> 25 pitch 0.50 mm -> 0.020" -> 20 mil -> 20 pitch 0.40 mm -> 0.016" -> 16 mil -> 16 pitch 0.20 mm -> 0.012" -> 12 mil -> 12 pitch Dave F Y

PCB Warpage in Reflow

Electronics Forum | Thu Jul 12 20:20:31 EDT 2007 | seankim10

I�m having problem with PCB with 16mil thickness due to warpage. the board convex up in the middle after 1st reflow. It seams the warpage is caused by CTE mismatch between PCB and multiple TSOP's, which are covering ~80% of the bottom side board area

Industry News: pitch mismatch (2)

Practical Components Helps Diagnose and Treat Head-in-Pillow Failure PBGA 928-HiP — A large component with a single small die is a recipe for HiP failure

Industry News | 2012-06-01 09:09:55.0

Head-in-Pillow (HiP) soldering defects are common with modern SMT component placement. As a result, Practical Components has introduced the PBGA 928-HiP, a component that is designed specifically to be susceptible to HiP defects. It features a large 4x4 body size, 928 balls and a single small die that has a propensity toward the ball-in-socket HiP soldering defect.

Practical Components, Inc.

Solder Joint Reliability

Industry News | 2018-10-18 08:49:15.0

Solder Joint Reliability

Flason Electronic Co.,limited

Technical Library: pitch mismatch (41)

Dam and Fill Encapsulation for Microelectronic Packages

Technical Library | 1999-08-27 09:29:49.0

Contract packaging houses have to contend with a large mix of die types and products. Flexibility and quick turnaround of package types is a must in this industry. Traditional methods of die encapsulation, (i.e., use of transfer-molding techniques), are only cost effective when producing a large number of components. Liquid encapsulants now provide similar levels of reliability1, and are cost effective...

Nordson ASYMTEK

Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies

Technical Library | 2021-01-03 19:24:52.0

Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.

SMTnet

Express Newsletter: pitch mismatch (162)

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne

Partner Websites: pitch mismatch (14)

Questions & Answers - PCB Libraries Forum - Page 22

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/questions-answers_forum34&SO=R_page22.html

:08am 0402 Capacitors Under 1 mm Pitch BGA By DaveCowl , 26 Nov 2012 at 3:31pm 3 4383 By DaveCowl 26 Nov 2012 at 5:28pm How Do I Find Similar Footprint in FPX

PCB Libraries, Inc.


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