Industry News | 2003-04-21 09:11:21.0
One for SMT Processes and one for SMT Systems
Industry News | 2012-07-12 10:34:27.0
The SMTA announced that it will have a Package-on-Package (PoP) Design and Assembly Center during their annual conference, SMTA International, taking place October 14-18, 2012 in Orlando, Florida.
Industry News | 2012-07-12 10:34:54.0
The SMTA announced that it will have a Package-on-Package (PoP) Design and Assembly Center during their annual conference, SMTA International, taking place October 14-18, 2012 in Orlando, Florida.
Industry News | 2012-06-29 14:47:47.0
The SMTA is pleased to announce that the program for SMTA International is finalized and available on-line at www.smta.org/smtai and registration is open.
Industry News | 2012-06-30 16:45:46.0
The SMTA is pleased to announce that the program for SMTA International is finalized and available on-line at www.smta.org/smtai and registration is open.
Industry News | 2011-05-03 22:50:52.0
Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.
Industry News | 2011-04-07 20:39:13.0
Combining an automatic SMD pick-and-place for series production with a semiautomatic placer for prototyping proves beneficial. A universal data interface developed by Essemtec ensures an easy, secure transition from prototyping into production and avoids confusion about data versions.
Industry News | 2013-05-28 14:30:51.0
A traceability solution should be able to assign assembly data to products without any doubt. Many systems, however, are likely to fail if there is manual intervention. Essemtec has now invented the integrated PCB identification system that no longer can be bypassed.
Industry News | 2016-12-01 19:42:40.0
Saki Corporation has partnered with Fuji America to incorporate its 3D automated optical inspection (AOI) and 3D solder paste inspection (SPI) systems into Fuji's Smart Factory SMT line at its Vernon Hills, IL facility. Saki's inspection and measurement systems will be used to ensure that the printed circuit boards produced at Fuji adhere to the highest standards of quality and reliability.
Industry News | 2016-03-31 18:09:22.0
Saki Corporation proudly announces its participation in Fuji Machine Manufacturing's "FUJI Smart Factory with Nexim" initiative. Saki's inspection and measurement systems will connect with Fuji's pick-and-place machines for a high productivity manufacturing process.
