Technical Library | 2019-05-21 17:20:36.0
Die attach material selection and process implementation play crucial roles in any microelectronic assembly. The chosen attach methods ultimately affect die stress, functionality, thermal management, and reliability of the assembly. Die attach applications are designed to optimize mechanical attachment of the die to the substrate, to create a thermal path from the die to the substrate, and to create an electrical path for a ground plane connection. Some of the more commonly used die attach materials in the microelectronics industry today are epoxies,polyimides, thermoplastics, silicones, solders, and special low outgassing, low stress, anisotropic adhesives.
Technical Library | 2018-09-21 10:12:53.0
Moisture accumulates during storage and industry practice recommends specific levels of baking to avoid delamination. This paper will discuss the use of capacitance measurements to follow the absorption and desorption behaviour of moisture. The PCB design used in this work, focused on the issue of baking out moisture trapped between copper planes. The PCB was designed with different densities of plated through holes and drilled holes in external copper planes, with capacitance sensors located on the inner layers. For trapped volumes between copper planes, the distance between holes proved to be critical in affecting the desorption rate. For fully saturated PCBs, the desorption time at elevated temperatures was observed to be in the order of hundreds of hours. Finite difference diffusion modelling was carried out for moisture desorption behaviour for plated through holes and drilled holes in copper planes. A meshed copper plane was also modelled evaluating its effectiveness for assisting moisture removal and decreasing bake times. Results also showed, that in certain circumstances, regions of the PCB under copper planes initially increase in moisture during baking.
Technical Library | 2021-03-04 15:16:27.0
Out-of-plane wrinkling has a significant influence on the mechanical performance of composite laminates. Numerical simulations were conducted to investigate the progressive failure behavior of fiber-reinforced composite laminates with out-of-plane wrinkle defects subjected to axial compression. To describe the material degradation, a three-dimensional elastoplastic damage model with four damage modes (i.e., fiber tensile failure, matrix failure, fiber kinking/splitting, and delamination) was developed based on the LaRC05 criterion. To improve the computational efficiency in searching for the fracture angle in the matrix failure analysis, a high-efficiency and robust modified algorithm that combines the golden section search method with an inverse interpolation based on an existing study is proposed.
Technical Library | 2009-03-25 17:14:11.0
This article presents design guidelines for helping users of HDMI mux-repeaters to maximize the device's full performance through careful printed circuit board (PCB) design. We'll explain important concepts of some main aspects of high-speed PCB design with recommendations. This discussion will cover layer stack, differential traces, controlled impedance transmission lines, discontinuities, routing guidelines, reference planes, vias and decoupling capacitors.
Technical Library | 2009-04-22 21:13:19.0
An optimal reflow profile is one of the most critical factors in achieving quality solder joints on a printed circuit board (PCB) assembly with surface mount components. A profile is a function of temperatures applied to the assembly over time. When graphed on a Cartesian plane, a curve is formed that represents the temperature at a specific point on the PCB, at any given time, throughout the reflow process.
Technical Library | 2009-07-22 18:33:41.0
This paper deals with the thermal effects of joule heating in a high interconnect density, thin core, buildup, organic flip chip substrate. The 440 μm thick substrate consists of a 135 μm thick core with via density of about 200 μm. The typical feature sizes in the substrate are 50 micron diameter vias is the core/buildup layers and 12 micron thick metal planes. An experimental test vehicle is powered with current and the temperature rise was measured. A numerical model was used to simulate the temperature rise in the TV.
Technical Library | 2010-09-10 09:47:06.0
An optimal reflow profile is one of the most critical factors in achieving quality solder joints on a printed circuit board (PCB) assembly with surface mount components. A profile is a function of temperatures applied to the assembly over time. When graphed on a Cartesian plane, a curve is formed that represents the temperature at a specific point on the PCB, at any given time, throughout the reflow process.
Technical Library | 2019-07-24 23:55:32.0
Voiding is a key concern for components with thermal planes because interruptions in Z-axis continuity of the solder joint will hinder thermal transfer. When assembling components with solder paste, there is a high propensity for voiding due to the confined nature of the solder paste deposits under the component. Once reflowed, many factors contribute to the amount of voiding in a solder joint such as the reflow profile, designs of the component, board and stencil, and material factors. This study will focus on the solder paste alloy and flux combination as well as profile and board surface finishes.
Technical Library | 2016-04-21 14:10:55.0
The world of electronics continues to increase functional densities on products. One of the ways to increase density of a product is to utilize more of the 3 dimensional spaces available. Traditional printed circuit boards utilize the x/y plane and many miniaturization techniques apply to the x/y space savings, such as smaller components, finer pitches, and closer component to component distances.This paper will explore the evolution of 3D assembly techniques, starting from flexible circuit technology, cavity assembly, embedded technology, 3 dimensional surface mount assembly, etc.
Technical Library | 2017-05-04 17:35:01.0
Most of today's printed circuit board base materials are anisotropic and it is not possible to use a simple method to measure thermal conductivity along the different axis, especially when a good accuracy is expected. Few base material suppliers' datasheet show X, Y and Z thermal conductivities. In most cases, a single value is given, moreover determined with a generic methodology, and not necessarily adapted to the reality of glass-reinforced composites with a strong anisotropy.After reminding of the fundamentals in thermal science, this paper gives an overview of the state-of the art in terms of thermal conductivity measurement on PCB base materials, and some typical values. It finally proposes an innovative method called transient fin method, and associated test sample, to perform reliable and consistent in plane thermal conductivity measurement on anisotropic PCB base materials.
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