Industry Directory: plasma clean before wirebond (3)

Tepla Inc.

Industry Directory |

Microwave Plasma System for assembly cleaning prior to wirebond, attach, encapsulation, and underfill.

Plasmatreat USA, Inc.

Industry Directory | Manufacturer

Plasmatreat is the global market leader in developing surface treatment solutions with atmospheric and low pressure plasma technology

New SMT Equipment: plasma clean before wirebond (8)

Plasma Cleaner

Plasma Cleaner

New Equipment | Cleaning Equipment

All kinds of printing or adhesive substrate before the surface activation, modification, grafting, roughening or cleaning. Application: .LCM, IC Packaging (Flip Chip, CSP, BGA, Lead Frame, etc.), LED packaging, SMT, PCB, FPC, optoelectronic c

Creating Nano Technologies inc

Plasma indicator

Plasma indicator

New Equipment | Dispensing

Easy plasma evaluation for as little as €3.00 by “color.” The indicator brings simplicity to plasma evaluation. Industry first technology can realize evaluation of in-plane distribution and 3d object. Very suitable for daily plasma

YKT EUROPE GmbH

Electronics Forum: plasma clean before wirebond (8)

Wire bonding on gold fingers

Electronics Forum | Tue Jul 01 17:38:24 EDT 2003 | jartman

I've faced this several times in the past, and the only real solution is to wirebond before SMT assembly. Everything leaves a residue, and trying to clean a residue off later is basically hopeless. This may require some trickery in your SMT process

soldering and bonding on gold PCB's

Electronics Forum | Wed Jan 09 17:03:44 EST 2002 | rob_thomas

We follow IPC-2221 recommendations for Au and don't have a problem as long as the Ni is under 150 microinches.This ensures a consistent process for us.Also we do plasma clean after SMt and prior to wirebond.That makes a big difference. Rob

Industry News: plasma clean before wirebond (6)

IPC & SMTA Announce Session 2 of High-Rel Cleaning & Conformal Coating Conference

Industry News | 2018-10-18 19:57:48.0

Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place November 13-15, 2018 at Chicago Marriott, Schaumburg, Illinois. The conference is focused on the cleanliness of highly dense electronic assemblies to achieve quality and reliability within the stated in-field environment.

Association Connecting Electronics Industries (IPC)

Plasmabrush – cold-active atmospheric-pressure plasma tool

Industry News | 2009-12-08 14:46:58.0

Whether coating, bonding, casting, printing or foaming is concerned – optimum and permanent adhesion can only be achieved with many substrates if the surface is pre-treated. The cold-active plasma beam of the patented Plasmabrush technology developed by Reinhausen Plasma opens up a whole range of new application possibilities for industrial processes under ambient pressure. Even temperature-sensitive substrates and thin-walled, fine and complex contours can be treated efficiently in a process that is both reliable and environmentally sound.

Reinhausen Plasma GmbH

Technical Library: plasma clean before wirebond (1)

Approaches to Overcome Nodules and Scratches on Wire Bondable Plating on PCBs

Technical Library | 2020-08-27 01:22:45.0

Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. The nodules and scratches were not defined by measurable dimensions and were considered to be unacceptable if there was any sign of a visual blemish on wire-bondable features. Analysis of the yield at a PCB manufacturer monitored monthly for over two years indicated that the target yield could not be achieved, and the main reasons for yield loss were due to nodules and scratches on the wirebonding pads. The PCB manufacturer attempted to eliminate nodules and scratches. First, a light-scrubbing step was added after electroless copper plating to remove any co-deposited fine particles that acted as a seed for nodules at the time of copper plating. Then, the electrolytic copper plating tank was emptied, fully cleaned, and filtered to eliminate the possibility of co-deposited particles in the electroplating process. Both actions greatly reduced the density of the nodules but did not fully eliminate them. Even though there was only one nodule on any wire-bonding pad, the board was still considered a reject. To reduce scratches on wirebonding pads, the PCB manufacturer utilized foam trays after routing the boards so that they did not make direct contact with other boards. This action significantly reduced the scratches on wire-bonding pads, even though some isolated scratches still appeared from time to time, which caused the boards to be rejected. Even with these significant improvements, the target yield remained unachievable. Another approach was then taken to consider if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful. A gold ball bonding process called either stand-off-stitch bonding (SSB) or ball-stitch-on-ball bonding (BSOB) was used to determine the effects of nodules and scratches on wire bonds. The dimension of nodules, including height, and the size of scratches, including width, were measured before wire bonding. Wire bonding was then performed directly on various sizes of nodules and scratches on the bonding pad, and the evaluation of wire bonds was conducted using wire pull tests before and after reliability testing. Based on the results of the wire-bonding evaluation, the internal specification for nodules and scratches for wirebondable PCBs was modified to allow nodules and scratches with a certain height and a width limitation compared to initially adopted internal specifications of no nodules and no scratches. Such an approach resulted in improved yield at the PCB manufacturer.

Teledyne DALSA

Career Center - Resumes: plasma clean before wirebond (1)

Equipment Maintenance Technician

Career Center | San Isidro Cabuyao Laguna, Philippines | Engineering,Maintenance,Production,Technical Support

                                                 Duties & Responsibilities (Equipment Technician):  Production line support, conduct setup and troubleshooting on handled machines such as COB and backend equipment.  Conduct Preventive maintenance

Express Newsletter: plasma clean before wirebond (828)

Partner Websites: plasma clean before wirebond (26)


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