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New Equipment | Cleaning Equipment
All kinds of printing or adhesive substrate before the surface activation, modification, grafting, roughening or cleaning. Application: ．LCM, IC Packaging (Flip Chip, CSP, BGA, Lead Frame, etc.), LED packaging, SMT, PCB, FPC, optoelectronic c
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New Equipment | Cleaning Equipment
Fast removal of residual photoresist on the wafer, the wafer surface to clean, etch rates with the highest industry. Apllication: ．Surface cleaning and modification for LCD, IC Packaging (Flip Chip, CSP, BGA, Lead Frame, etc.), LED Packaging,
Electronics Forum | Mon May 17 13:21:45 EDT 2021 | SMTA-64387881
PWB Bake out or other elevated temperture processes can cause issues with oxidation of that Nickel layer. The gold porosity can vary from batch to batch, but also process changes can contribute. Are you baking the boards or have previous reflow pro
Electronics Forum | Fri Oct 18 06:33:28 EDT 2002 | johnw
Here's one for you lot, dos anyone have a method or a vendor that can clean the ball's of BGA's of oxides to bring them back to 'new' conditions ? I've got a bathc of components that are fairly old and I get some issues with soldering them which I b
Industry News | 2019-11-05 22:07:01.0
Tenting a via refers to covering via with soldermask to enclose or skin over the opening. A via is a hole drilled into the PCB that allows multiple layers on the PCB to be connected to each other. A non tented via is just a via that is not covered with the soldermask layer. Leaving these vias exposed or covered has pros and cons depending on the your design and manufacturing requirements.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
Career Center | San Isidro Cabuyao Laguna, Philippines | Engineering,Maintenance,Production,Technical Support
Duties & Responsibilities (Equipment Technician): Production line support, conduct setup and troubleshooting on handled machines such as COB and backend equipment. Conduct Preventive maintenance
SMTnet Express, January 23, 2014, Subscribers: 26486, Members: Companies: 13559, Users: 35667 Testing Intermetallic Fragility on Enig upon Addition of Limitless Cu by Martin K. Anselm, Ph.D. and Brian Roggeman; Universal Instruments Corp
Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/technology-roadmap/
• Inner Layer - 10 oz • Inner Layer - 16 oz Buried/Blind Via 10+N+10 (HDI) Plasma Desmear Yes Outline Tolerance +/-.004 Surface Finish • HASL • ENIG • Immersion Silver • OSP (ENTEK) • Carbon • Immersion Tin • Electrolyic Gold • ENEPIG • ENIPIG Impeadance Control
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/events/aci-technologies-2-day-techexpo
: Circuit board cleaning and conformal coating (Nordson MARCH and Nordson ASYMTEK) BGA rework using infrared and hot air techniques (PDR) Increasing BGA robustness with BGA underfill
