New SMT Equipment: plated and through and hole and failures (7)

PCB Rework and Repair Training

New Equipment | Education/Training

This two day course is based on the IPC-7721. Students will learn how to repair surface mount pads, BGA pads, finger contacts, traces, laminate, plated through holes and more.  Students will be introduced to the proper techniques for SMT & PTH compon

Precision PCB Services, Inc

Inspection Services - Visual and X-Ray

Inspection Services - Visual and X-Ray

New Equipment | Inspection

ACI Technologies employs personnel that are Master IPC Trainers and Certified IPC Trainers for all IPC inspection standards. Visual Inspection Services ACI Technologies employs personnel that are Master IPC Trainers and Certified IPC Trainers for a

ACI Technologies, Inc.

Electronics Forum: plated and through and hole and failures (24)

Silver Epoxy and CEM3

Electronics Forum | Wed Aug 26 12:02:23 EDT 1998 | Steve Joy

Does anyone have any experience they are willing to share on Ag epoxy used as a copper through hole plating replacement? Was CEM3 used? What are the limitations? Thanks, Steve

Material Ageing and Storage

Electronics Forum | Thu Feb 22 04:00:02 EST 2001 | Scott B

We are increasingly being asked to store components for longer and longer periods which we know through experience leads to reduction or total loss of solderability of the parts. 1) What is the industry accepted shelf life of tin/lead plated compone

Used SMT Equipment: plated and through and hole and failures (1)

Universal Instruments  Universal Radial and Axial through-hole insertion machines

Universal Instruments Universal Radial and Axial through-hole insertion machines

Used SMT Equipment | Pick and Place/Feeders

Spare parts for Universal Radial and Axial through-hole insertion machines (RAD5 6360D, RAD8 6380A, RAD8 XT 6380B, VCD5 6241D, VCD8 6241F, VCD Dual 6292A, SEQ 2596A, SEQ5, SEQ8). UIC Part Number / Part Description 15754 O'RING 15755 O'RING 15759

Tekmart International Inc.

Industry News: plated and through and hole and failures (32)

Now Available: Amendments for J-STD-001F and IPC-A-610F

Industry News | 2016-01-17 19:26:58.0

In order to keep up with industry demand, IPC has released amendments for J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610F, Acceptability of Electronic Assemblies. For each standard, IPC-A-610F Amendment 1 and IPC J-STD-001F Amendment 1 represents a critical shift to deliver necessary updates to these already robust standards.

Association Connecting Electronics Industries (IPC)

IPC Workshops Highlight Updates to Key Industry Standards: IPC-A-610, J-STD-001, and IPC-A-600 and IPC-6012

Industry News | 2010-04-19 12:56:32.0

BANNOCKBURN, Ill., USA, - The world’s most widely used standards for printed boards and electronic assemblies were recently updated, providing new coverage for advanced technologies and processes as well as guidance on the new challenges that state-of-the-art can bring. To help industry members understand the ramifications of the changes to the standards that they and their customers depend on, IPC will host a number of full-day technology workshops, taught by the leaders of the task groups that worked on the standards’ revisions.

Association Connecting Electronics Industries (IPC)

Technical Library: plated and through and hole and failures (8)

Investigation of Through-Hole Capacitor Parts Failures Following Vibration and Stress Testing

Technical Library | 2019-06-21 10:39:15.0

Recently, an ACI Technologies (ACI) customer called to discuss failures that they had observed with some through-hole capacitor parts. The components were experiencing failures following vibration and accelerated stress testing. Upon receipt of the samples, ACI performed three levels of inspection and Energy Dispersive Spectroscopy (EDS) testing to investigate the root cause of the failures. These analyses enabled ACI to verify the elements comprising the solder joints and make the following recommendations in order to prevent future occurrences. The first inspection was to investigate the capacitor leads using optical microscopy, and no anomalies were found that could indicate bad parts from the vendor or improper handling prior to assembly. However, vertical fill in the barrel of the plated through-holes was too close to the IPC-A-610 minimum specification of 75% to determine a pass/fail condition, and therefore required further investigation.

ACI Technologies, Inc.

Filling of Microvias and Through Holes by Electrolytic Copper Plating –Current Status and Future Outlook

Technical Library | 2020-03-12 13:10:35.0

The electronics industry is further progressing in terms of smaller, faster, smarter and more efficient electronic devices. This continuous evolving environment caused the development on various electrolytic copper processes for different applications over the past several decades. (...) This paper describes the reasons for development and a roadmap of dimensions for copper filled through holes, microvias and other copper plated structures on PCBs.

Atotech

Videos: plated and through and hole and failures (42)

This video describes the IPC A-600 training and certification program.

This video describes the IPC A-600 training and certification program.

Videos

This video describes the IPC A-600 training and certification program. The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring bo

BEST Inc.

This video describes the IPC A-600 training and certification program.

This video describes the IPC A-600 training and certification program.

Videos

This video describes the IPC A-600 training and certification program. The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring bo

BEST Inc.

Training Courses: plated and through and hole and failures (2)

IPC-6012 Qualification and Performance Specification for Rigid Printed Boards Training and Certification Program

Training Courses | ON DEMAND | | IPC-6012 Trainer (CIT)

The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.

PIEK International Education Centre

IPC-A-600 Acceptability of Printed Boards Training and Certification Program

Training Courses | ON DEMAND | | IPC-600 Trainer (CIT)

The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.

PIEK International Education Centre

Events Calendar: plated and through and hole and failures (2)

FREE Webinar: Eliminate Circuit Board Problems and Failure Modes

Events Calendar | Tue Jan 23 00:00:00 EST 2018 - Tue Jan 23 00:00:00 EST 2018 | New Milford, Connecticut USA

FREE Webinar: Eliminate Circuit Board Problems and Failure Modes

Vision Engineering Inc.

Qualification and Reliability of Microvias

Events Calendar | Tue Dec 04 00:00:00 EST 2018 - Tue Dec 04 00:00:00 EST 2018 | ,

Qualification and Reliability of Microvias

CALCE Center for Advanced Life Cycle Engineering

Express Newsletter: plated and through and hole and failures (732)

Partner Websites: plated and through and hole and failures (388)

IPC-2221 & 2222 and Through-hole Pad Stacks - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc2221-2222-and-throughhole-pad-stacks_topic2586_post10872.html

+ 0.15 = Hole Size. However, IPC-2222 has a table that is inclusive and calculates the hole size based on Density Levels. See image below. Once the Hole Size is established, the main point for pad size calculation in the IPC-2221 standard is the minimum annular ring of the plated through-hole pad stack after fabrication tolerances are

PCB Libraries, Inc.

Webinars and Webtorials

Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm

form a reliable joint with the assembly process automated if volumes require. Through hole paste reflow can benefit using solder bricks to increase joint volume and decrease flux residues. Some placement machine suppliers offer produced cut and form

Surface Mount Technology Association (SMTA)


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Selective soldering solutions with Jade soldering machine

High Precision Fluid Dispensers
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World's Best Reflow Oven Customizable for Unique Applications