Industry Directory | Distributor / Manufacturer
Midwest Circuit Technology provides Carbide Router Bits and End Milling Cuters for use in PCB Depaneling equipment. We have over 35 years of supplying tools and machining experience in drilling, Routing, Test Fixture manufacture.
Jetting Simplified Jetting pumps are excellent for dispensing small volumes of fluid at high rates of speed. The NCM5000 simplifies jetting to its basic elements - this means easy set up, cleaning, and maintenance for you. The drive system is design
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Electronics Forum | Wed Feb 03 06:35:14 EST 1999 | Teemu M�kiniemi
Hi! Does anyone know any roadmaps for board plating materials. Especially I'm interested in finishes, which are plated onto copper. Teemu M�kiniemi
Electronics Forum | Thu Jun 13 15:33:49 EDT 2002 | john
I opened a two product boxes which are similar and have PCBs. The PCB in one box is gold plated. Can anyone explain why it needs gold plating? Thanks in advance
Used SMT Equipment | Screen Printers
MPM, Screen Printer, type UP 2000/B , s.n. 22256, size Approx 1,17 x 1,60 x 1,50 meters , max plate 20' x20', with CRT monitor and internal PC, CE Marked
Used SMT Equipment | SMD Placement Machines
* DOS * Flying Nozzle change * Fiducial camera * Pneumatic tape feeder * Locate Pin * Edge clamp * Z servo push plate * Entrance sub stop * Exit sub stop * Auto width adjust * Feeder float detection
Industry News | 2013-07-22 09:54:27.0
GPD Global has introduced its new NCM5000 dispense pump for easy jetting. With only two wetted parts and no seals or springs to replace or adjust, field operation is simple.
Industry News | 2003-02-20 08:39:01.0
Purchased the inventory and rights to the replacement parts business of Advanced Chemill Systems
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2019-06-04 10:19:46.0
Interconnection technology relies very heavily on the ability of the conductors on a printed wiring assembly to maintain reliable signal integrity. Harsh environmental factors can precipitate a loss of conductivity due to oxidation and corrosion. Connections are typically soldered or inserted using pressure fitted connectors to obtain enough surface contact to meet the electrical conductivity requirements. In pressure contacts, surface integrity is especially critical where the abrasive effects of retraction and insertion can wear off the metallic finish from the contact area. This can expose the underlying copper or nickel and lead to increased resistance at the contact points. These types of conductors are frequently found in card edge connectors where the terminations are plated with a layer of nickel and gold (frequently referred to as gold fingers). A hard gold is typically used containing very small amounts of nickel and cobalt to increase the wear resistance.
Jetting Simplified Jetting pumps are excellent for dispensing small volumes of fluid at high rates of speed. The NCM5000 simplifies jetting to its basic elements - this means easy set up, cleaning, and maintenance for you. The drive system is design
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Training Courses | | | IPC-6012 Specialist (CIS)
The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.
Training Courses | | | IPC-6012 Trainer (CIT)
The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.
Events Calendar | Tue Feb 12 00:00:00 EST 2019 - Tue Feb 12 00:00:00 EST 2019 | ,
Webinar: BGA and Area Array Process Defects - Causes & Cures
Events Calendar | Mon Sep 14 00:00:00 EDT 2020 - Mon Sep 14 00:00:00 EDT 2020 | ,
Printed Circuit Board (PCB) Inspection & Quality Control
Career Center | Central, Hong Kong | Engineering,Management,Production,Purchasing,Quality Control,Research and Development,Technical Support
We have lots of PCB manufacturing openings: SMT Engineers/Managers Plating Engineers/Managers Quality Engineers/Managers Process Engineers Supply Chain Directors Lots of jobs in Injection Moulding: Business Development Directors
Career Center | Colorado Springs, Colorado USA | Production
3rd Shift: The Chem Etch Tech will work with a process that plates, etches, or performs metal prep according to Photo Stencil controlled procedures. Operate all required department equipment per published/current process specifications. Generally lea
Career Center | Alta Loma, California | Engineering,Quality Control,Research and Development
Rigid and Flexible Printed Circuits Plating and Metal Finishing Operations Six Sigma Work Instruction Documentation Process Development Equipment Selection and Specification New Facility Startup Air, Water and Hazardous Waste Environmental Reporting
Career Center | 厦门, China | Sales/Marketing
It supplies automation components to heavy industry manufacturers around the world. We have plc, DCS, operation panel, servo drive and servo motor, excitation plate, other electrical equipment accessories inventory, also provide production products.
SMT Express, Issue No. 2 - from SMTnet.com Volume 1, Issue No. 2 Wednesday, July 14, 1999 Featured Article Continued From Previous Page PRINTED CIRCUIT BOARD FABRICATION BASICS AN OUTLINE Earl Moon Proof Of Design (POD) 8. PLATING (AND
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5495
Wire-Bonding Reliability of Electroless Ni/Pd/Au Plating - Influence of Electroless Pd Deposition Reaction 中文 MEMBERS LOGIN Membership Become a Member
| http://www.thebranfordgroup.com/dnn3/Employees/OnlineAuctionAdmin/TRCCircuits/tabid/1902/AuctionID/1636/Default.aspx?page=3
:00 AM (EDT) Closes: November 30, 2022 at 10:00 AM (EDT) Preview/Inspection: B y Appointment Only Call 203.488.7020 or Click Here To Schedule Appointment 91 Plating Temperature Control Cabinet Sold at TRC Circuits on 11/30/2022 Vadnais Heights MN Next Item Lot Number: 91 Description
