Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
New Equipment | Wave Soldering
The most advanced high-performance wave soldering system designed for high-volume manufacturing. Electra's proven performance has provided the electronics assembly industry with world-class soldering results. The Electra system is designed with
New Equipment | Wave Soldering
The ELECTROVERT VectraElite is the wave soldering solution for medium to high volume production that requires fast changeover, process flexibility, and system reliability. The VectraElite combines innovative technology in an accessible platform provi
New Equipment | Fabrication Services
Our Service PCB Assembly and PCB&PCBA design are our main business.We are able to undertake a high quality Printed Circuit Board Assembly on competitive prices and flexible conditions.We are a complete “One- Stop” resource for printed circuit board
New Equipment | Fabrication Services
Minimum line width/space: 4mils Surface finish: immersion gold Board thickness: 1.60MM Minimum drilled hole diameter: 4mils Copper thickness: 0.5oz Special process : 0.25MM BGA , resin plugged vias in BGA pads
New Equipment | Industrial Automation
Want to buy best parts with a competitive price ? Please check it with mailto:unity@mvme.cn! we will response you in 24 hours! Contact: Sandy Lin Email:unity@mvme.cn Skype:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ
New Equipment | Industrial Automation
Want to buy best parts with a competitive price ? Please check it with mailto:unity@mvme.cn! we will response you in 24 hours! Contact: Sandy Lin Email:unity@mvme.cn Skype:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ
Pump UP your material quality! There’s no denying it: Electronic components have to work. An optimal dispensing performance as well as an absolutely homogeneous and bubble-free material are the prerequisites for this. The new LiquiPrep LP804 s
Whatsapp 0086 134 2516 4065 Skype: dzyljy China 2 part ab resin HV components, bushings, insulators potting machine,Motor potting, magnet bonding, Encapsulation of transformers, igniters, noise filters Machine information: Mixing ratio ： 100:
The 3M Wafer Support SystemTM provides a temporary bonding solution to support wafers during conventional thinning operations as well as post thinning operations. The 3M UV curable adhesive is spun on the wafer surface and is used as a bonding agent
