Electronics Forum | Thu Sep 13 11:21:45 EDT 2001 | aldo_maldonado
We've had several instances of parts (1206R, SOT-23) popping off of their location during reflow. Parts placement is OK, paste brick is aligned and compact before oven. But we get random parts off their location just lying somewhere else on the boar
Electronics Forum | Thu Sep 13 13:34:49 EDT 2001 | Dave G
Too much Convection Airflow in the Reflow Oven blowing parts around ? Moisture Contaminated Parts out gassing ? Board out gassing? Just some thoughts, DG
Electronics Forum | Fri Sep 14 01:43:36 EDT 2001 | dhanashekar
please check the following also. in one of the cases we came across the second point was the problem. 1. the parallelisum of the conveyor. 2. the warpage of the board. 3. the stencil.(the differential height in the paste deposition of the two pads
Electronics Forum | Thu Sep 27 21:19:56 EDT 2001 | stimpy
>> try a linear ramp to allow the entire pcb to heat up evenly. What is your conveyor speed?
Electronics Forum | Thu Sep 13 17:57:59 EDT 2001 | davef
You're correct. It is curious. Possible angles to look at are: 1 WS609 loves moisture in the air. In high humidity shops, this paste hakes-on liquid. If this is the case, you should also see slumping, resulting in fine pitch bridging, and solder
Electronics Forum | Fri Sep 28 09:30:07 EDT 2001 | kmorris
Just had a similar phenomenon 2 days ago. May relate to your issue --- or not. Like you, I did a once over looking for mechanical obstruction & couldn't find any. Ran a thermal profile on the offending PCB & all checked out. Looked in end of oven
Electronics Forum | Mon Jul 07 10:31:27 EDT 2008 | realchunks
Yeah, I burned my Pop-Tarts* this morning. Someone turned the knob on the cafeteria toaster oven. Gotta check them knobs no matter where ya go. (* = Poster has no affiliation with Pop-Tarts or Pop-Tarts products)
Electronics Forum | Tue Aug 16 07:51:16 EDT 2011 | a
C-SAM is a non-destructive alternative that a lot laboratories and chip manufacturers use. Dye and Pry would work I suppose although I have never done it in practice with PoP but it should be any different for PoP.
Electronics Forum | Tue Apr 15 18:49:37 EDT 2014 | hegemon
Evtimov, Are you talking about placing an already built POP package, or about building the POP package at the SMT line? 'hege
Electronics Forum | Wed Apr 16 19:17:11 EDT 2014 | hegemon
OK, POP already done, and you are mounting the POP device. You are seeing opens. Opens at the device/PWB? or opens at the device/device interface? Or possibly both? 'hege
