Industry Directory: porosity (2)

Precision Engineered Ceramics, Inc.

Industry Directory |

Precision Engineered Ceramics, Inc. produces precision machined ceramic spares for semiconductor wafer processing equipment. In addition, we offer fast delivery of complex geometry ceramic components made from high purity aluminum oxide (alumina).

Fischer Technology, Inc.

Industry Directory | Manufacturer

As trends towards the miniaturization and increased functional integration of electronics, the demands on quality assurance are rising. FISCHER has many coating thickness measurement solutions for the electronics sector.

New SMT Equipment: porosity (12)

temate 2700 Weld Inspection System

temate 2700 Weld Inspection System

New Equipment |  

The temate 2700 has proven capabilities to provide full volumetric, ultrasonic inspection of laser welds in tailor welded blanks, body assembly, drive-shafts, ring gear components, and other automotive parts. The temate 2700 directly inspects final

Innerspec Technologies, Inc.

temate 2700 Weld Inspection System

New Equipment |  

The temate 2700 has proven capabilities to provide full volumetric, ultrasonic inspection of laser welds in tailor welded blanks, body assembly, drive-shafts, ring gear components, and other automotive parts. The temate 2700 directly inspects final

Innerspec Technologies, Inc.

Electronics Forum: porosity (47)

Porosity in Good Plating

Electronics Forum | Sun Jul 06 14:12:51 EDT 2003 | ramanandkini

I wish to inform you that our boards are reflow soldered with Infineon (OSRAM) make SMT LEDs.

SAC305 preforms not wetting to ENIG pad in fluxless process

Electronics Forum | Mon Apr 26 17:09:05 EDT 2021 | kwalker

Sounds like you are getting oxidation of the nickel under the gold layer. If the gold is porous it will allow the nickel underneath to oxidize, which is the dark dull layer you are seeing, and why when you apply flux it solders just fine - the flux i

Industry News: porosity (26)

High-Tech Conversions’ GREEN MONSTER Is Both Tough and Green on PCBs

Industry News | 2009-08-19 19:55:21.0

EAST WINDSOR, CT — August 2009 — High-Tech Conversions Inc., a manufacturer of high-quality wiping products and a supplier of consumable items used in cleanrooms, assembly lines, laboratories and manufacturing, announces that its GREEN MONSTER formulation has the abrasion resistance to withstand the high friction caused by the wiping action, the integrity to resist fibers from being pulled off by sticky solder paste, and the toughness to withstand the harsh scraping and grating action caused by the stencil’s apertures.

High-Tech Conversions

High-Tech Conversions Highlights GREEN MONSTER! Stencil Wiping Fabric

Industry News | 2009-12-07 15:00:46.0

EAST WINDSOR, CT — December 2009 — High-Tech Conversions Inc., a manufacturer of high-quality wiping products and a supplier of consumable items used in cleanrooms, assembly lines, laboratories and manufacturing, highlights its GREEN MONSTER! patent pending stencil wiping fabric.

High-Tech Conversions

Technical Library: porosity (3)

Paper Substrates and Inks for Printed Electronics

Technical Library | 2023-03-13 19:40:21.0

The present work explores the effects of paper properties on conventional silver-based conducting inks. The effects of smoothness, relative humidity, porosity, permeability and wettability on electrical properties of silver inks on different paper substrates were studied. Another objective of this work was to prepare and study polyaniline synthesized in the presence of different lignosulfonates.

Western Michigan University

Defect Features Detected by Acoustic Emission for Flip-Chip CGA/FCBGA/PBGA/FPBGA Packages and Assemblies

Technical Library | 2017-06-22 17:11:53.0

C-mode scanning acoustic microscopy (C-SAM) is a non-destructive inspection technique showing the internal features of a specimen by ultrasound. The C-SAM is the preferred method for finding “air gaps” such as delamination, cracks, voids, and porosity. This paper presents evaluations performed on various advanced packages/assemblies especially flip-chip die version of ball grid array/column grid array (BGA/CGA) using C-SAM equipment. For comparison, representative x-ray images of the assemblies were also gathered to show key defect detection features of the two non-destructive techniques.

Jet Propulsion Laboratory

Express Newsletter: porosity (2)

Partner Websites: porosity (41)

Vitronics AlphaWave

1st Place Machinery Inc. | http://www.firstplacemachinery.com/first_place_smt_pcb_wave_solder_vitronics.html

). Activation aireknife via tracking system Stone Material: VYON FF Stone Porosity: 35 micron Compressed Air Control Unit: Standard Air Compressor

1st Place Machinery Inc.

Untitled

Baja Bid | https://bajabid.com/wp-content/uploads/2023/06/XT-V-130-flyer-EN.pdf

. Populated and unpopulated PCBs • View surface mount defects i.e. misaligned devices, solder joint porosity, bridging • Detailed inspection of vias, through-hole plating and multi-layer alignment

Baja Bid


porosity searches for Companies, Equipment, Machines, Suppliers & Information

Sm t t t t t t t t t t net
  1 2 3 4 5 6 7 8 9 10 Next