Nano-copper sintering in formic acid vapor.
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Register for the webinar today:https://pages.zestron.com/cleaning-with-ph-neutral-chemistry-background-applications-and-benefits The greater use of lead-free solder paste and the required higher reflow profiles have resulted in more difficult to re
There is SPI for Screen Printing. AOI for Pick and Place. Now there is RPI (Reflow Process Inspection) for the Reflow Oven. KIC's RPI provides production reports such as yield analysis, DPMO, Pareto Charts, Cpk and much much more. When RPI is use
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EKT AOI machine application: inspection after stencil printing, pre/post reflow oven, pre/post wave soldering?FPC etc. Stencil printing: Solder unavailability, insufficient or excessive solder, solder misalignment, bridging, stain, scratch etc. Compo
