Industry Directory: post reflow organic fod (1)

Surface Mount Technology Association (SMTA)

Surface Mount Technology Association (SMTA)

Industry Directory | Association / Non-Profit / Training Provider / Events Organizer

The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.

New SMT Equipment: post reflow organic fod (8)

AQUANOX® A4651US - Low pH Ultrasonic Immersion Cleaner

AQUANOX® A4651US - Low pH Ultrasonic Immersion Cleaner

New Equipment | Cleaning Agents

AQUANOX® A4651US is a low pH aqueous cleaning solution designed exclusively for use in ultrasonic immersion cleaning systems. AQUANOX® A4651US will provide brilliant solder joints with no sump side additives and cleans exceptionally well on the late

KYZEN Corporation

SMT PCBA In-line Cleaning Machine SME-6200

SMT PCBA In-line Cleaning Machine SME-6200

New Equipment | Cleaning Equipment

SMT PCBA In-line Cleaning Machine SME-6200 PCB width 50~600mm Conveyor net speed 100~1500mm/min Clean tank 300L Machine weight 2000KG Product description: SMT PCBA In-line Cleaning Machine SME-6200, PCB width 50~600mm, Conveyor net speed 100~

Flason Electronic Co.,limited

Electronics Forum: post reflow organic fod (12)

Re: REFLOWING WHITE TIN PLATED PADS

Electronics Forum | Wed Aug 18 12:35:41 EDT 1999 | Earl Moon

WE ARE CURRENTLY HAVING PROBLEMS REFLOWING BOARDS WITH WHITE TIN PLATING. WE ARE NOT GETTING GOOD WETTING ON THE PADS. WE HAVE CHECKED THE REFLOW PROFILE AND TRIED DIFFERENT PASTE'S. WE THINK THERE MAY BE CONTAMINATION OR OXIDATION ON THE

AOI for solder inspection

Electronics Forum | Sun Nov 08 10:22:52 EST 2009 | doremi

Hi everybody, First of all, to have process under 100% control you should have AOI after every active process in the pcb assembly line : - Post printing (2D or 3D Solder paste inspection machine); - Post reflow; - Post selective(wave solder). It i

Industry News: post reflow organic fod (22)

SMT Hautes Technologies Selects MIRTEC for Leading-Edge 3D AOI Technology

Industry News | 2016-11-14 20:04:34.0

MIRTEC, “The Global Leader in Inspection Technology,” is pleased to announce that SMT Hautes Technologies, has selected MIRTEC’s award winning MV-7 OMNI as their future 3D AOI platform of choice.

MIRTEC Corporation

MIRTEC to Exhibit Its Award-Winning 3D AOI and 3D SPI Systems at SMTAI 2016

Industry News | 2016-08-29 18:31:30.0

MIRTEC, “The Global Leader in Inspection Technology,” will premier its award-winning 3D AOI and 3D SPI systems in Booth #707 at the 2016 SMTA International Exhibition. The exhibition will take place September 27-28, 2016 at the Donald Stephens Convention Center located in Rosemont, IL.

MIRTEC Corporation

Technical Library: post reflow organic fod (63)

Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection?

Technical Library | 2020-11-04 17:49:45.0

OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.

ZESTRON Americas

Thermal Residue Fingerprinting: A Revolutionary Approach to Develop a Selective Cleaning Solution

Technical Library | 2009-07-01 09:24:25.0

During the last 5 years, the processes to remove flux residues especially for lead-free and challenging geometries have demonstrated new cleaning obstacles which have to be overcome.i A new methodology has been recently developed to further increase the propensity for successful cleaning.ii At the core of this method is the thermal identification of the residue matrix. Thermal energy changes the physical state, i.e. transitions between liquid, solid and gas phases. By taking advantage of such specific information during phase transitions, the cleaning process can be tailored to such settings, which in turn increases the cleaning success significantly.

ZESTRON Americas

Videos: post reflow organic fod (1)

ORPRO Vision SPI Presentation

ORPRO Vision SPI Presentation

Videos

ORPRO Vision SPI Presentation. This presentation introduces the methods and technology used by ORPRO Vision in the Symbion P36 Plus SPI system. For additional information, please contact ORPRO Vision at sales.us@orprovision.com sales.eu@orprovision

Orpro Vision GmbH

Career Center - Resumes: post reflow organic fod (12)

Pedro Gomes

Career Center | , Portugal | Engineering,Maintenance,Production,Quality Control,Technical Support

SMT Process engineer Quality Efficiency Continuous improvement 11 years of experience in high volume production in a Japanese corporation Expertise in: Solder paste printing (DEK, Panasonic) Adhesive dispensing (FUJI, Panasonic) Components Pick and p

SMT Prosess/Production Engineer

Career Center | Delhi, India | Engineering,Production,Quality Control

Programming, Operation, Maintenance,Troubleshooting of SMT machines. Programming of cyber optics/saki(AOI) Programmingn of pcb seperater Temperature profiling (Making & Soldering) Testing,Troubleshooting of microcontroller based PCAs

Express Newsletter: post reflow organic fod (935)

Partner Websites: post reflow organic fod (5)

Defluxing and PCB Cleaning - ITW EAE

| https://www.itweae.com/applications/cleaning/defluxing-and-pcb-cleaning

In-line Aquastorm 60 In-line Aquastorm 50 Batch Aquastorm FSM MicroCel Centrifugal Vitronics Soltec Centurion Reflow Delta X Wave ZEVAv Selective ZEVAm

Solder Joint Reliability of Pb-free Sn-Ag-Cu Ball Grid Array (BGA) Components in Sn-Pb Assembly Proc

ShenZhen J-Wide Electronics Equipment Co.,Ltd | https://www.jwide-smt.com/sv/solder-joint-reliability-of-pb-free-sn-ag-cu-ball-grid-array-bga-components-in-sn-pb-assembly-process/

: electroless nickel immersion gold ( ENIG ) and organic solderability preservative ( OSP ) on copper . Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste

ShenZhen J-Wide Electronics Equipment Co.,Ltd


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