Electronics Forum | Mon Mar 06 10:33:30 EST 2006 | PWH
Wasn't the potato chip invented by accident when someone dropped sliced potatoes in hot oil? Maybe this could be the new thing! �Lead-Tots� or something like that.
Electronics Forum | Fri Jun 14 14:29:22 EDT 2002 | davef
Russ makes good points. Search the archives for: * Links to rework machine profiles. * Discussion on people causing corner shorts on their BGA, when heating them too rapidly, making the corners to curl like potato [potatoe?] chips.
Electronics Forum | Wed Apr 25 10:37:14 EDT 2001 | davef
If you heat a BGA too quickly, the corners of the device will curl towards the ceiling [potato chip], because they come to temperature faster that other areas. Adding to this, thinner substrates tend to potato chip more and faster than thicker subst
Electronics Forum | Tue Sep 10 08:22:36 EDT 2002 | davef
I doubt that the interposer is FR4, it's more likely to be BT. Warp during reflow is a function of material a reflow recipe. Your ramp is too fast and is causing the interposer to bend like a potato chip.
Electronics Forum | Mon Jun 13 01:38:59 EDT 2011 | kenneth0
Hello Steve, i think you are experiencing the potato chip effect, where temperature difference at the center and edges are huge; causing BGA edges to tilt down or up.Try narrow down the temperature difference between the center of BGA and corner. I
Electronics Forum | Mon Jun 18 16:48:00 EDT 2001 | Gil Zweig
We have found a significant number of PBGA problems associated with physical deformation of the package. Deformations such as dishing (potatoe chipping) and delamination under the die (popcorning). These can be detected by x-ray by the variation patt
Electronics Forum | Mon Nov 27 08:05:50 EST 2006 | davef
There is no standard for a strain gage measurement of allowable deflection of a board or a fixture. It's possible that your fixture is causing the BGA cracking that you see. What protion of the BGA is cracking? If it is the solder connection, sear
Electronics Forum | Tue Apr 10 10:10:03 EDT 2001 | Rob Fischer
Obviously the less mass in the wave the better. There will be less heat sinking and less push on the solder. Pallet thickness is typically a function of the tallest component on the board. If the board has one component that is tall but small in a
Electronics Forum | Mon Jun 18 11:23:44 EDT 2001 | Gil Zweig
BGA defects observed with x-ray inspection fall into catagories. One catagory is the obvious defects; i.e. soledr bridges, missing balls, excessive solder voids. The second catagory is the more subtle "potential" defect. This is where variations in
Electronics Forum | Fri Aug 22 23:17:22 EDT 2003 | Hoss
Mike, Any chance these parts have been sitting around esposed to your factory's ambient conditions, not in a vacuum sealed bag or dry box? If they haven't, you may have parts with a high moisture content which could cause "potato chipping" you desc
