The mission of Unipress is to use high pressure methods for advanced fundamental research and technology development. The main fields: Solid state physics, Optoelectronics, Sintering of nanocrystalline materials...
New Equipment | Industrial Automation
Select the right products & services to meet your needs! PLeases contact us Email:unity@mvme.cn Contact: Sandy Lin Email:unity@mvme.cn Skype:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 Product： Quali
New Equipment | Solder Paste Stencils
Tropical Stencil’s Laser Cut SMT Stencils are produced utilizing high speed lasers to produce the smoothest aperture wall possible. Far superior to chemically etched stencils, and with emerging new materials, stencils are produced using “fine grain”
Electronics Forum | Mon Mar 06 17:57:39 EST 2006 | slthomas
Not here, but I'd be interested in hearing what you found.
Electronics Forum | Wed Mar 08 12:38:51 EST 2006 | moonshine
On my site and in my book, there is considerable information answering all your questions. Visit http://www.moonmanondarkside.com and choose your area of interest. All information listed is free. MoonMan
Used SMT Equipment | Chipshooters / Chip Mounters
Product name: YV100X YAMAHA multi-functional chip mounter Product number: YV100X Products in detail YAMAHA multi-function placement machineYAMAHA YV100X substrate size: ATS20 (end to put) W -AT assembly: L460 * W250 (Max)/L50 * W50 (Min)substrate t
Used SMT Equipment | Chipshooters / Chip Mounters
Product name: YV100X YAMAHA multi-functional chip mounter Product number: YV100X Products in detail YAMAHA multi-function placement machineYAMAHA YV100X substrate size: ATS20 (end to put) W -AT assembly: L460 * W250 (Max)/L50 * W50 (Min)sub
Industry News | 2013-12-10 12:00:38.0
The SMTA is pleased to announce the Best Papers from SMTA International 2013. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. To reward exceptional achievement, $1,000 awards and plaques are given for the Best of Conference Presentation, Best of Proceedings Paper, and the Best International Paper.
Industry News | 2014-04-08 11:43:03.0
Isola Group has launched a technology-licensing program to mitigate conductive anodic filamentation (CAF) problems in the fabrication of PCBs. This proprietary manufacturing technology, which is offered by ISOLA USA Corp. "Isola USA", reduces the number of voids in resin-impregnated dielectrics, which is a major source of CAF failures.
Parts & Supplies | Assembly Accessories
Product name: YV100X YAMAHA multi-functional chip mounter Product number: YV100X Products in detail YAMAHA multi-function placement machineYAMAHA YV100X substrate size: ATS20 (end to put) W -AT assembly: L460 * W250 (Max)/L50 * W50 (Min)sub
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Parts & Supplies | Pick and Place/Feeders
FUJI XP242 XP243 nozzle spring DEPN3242 Model: DEPN3242 Model: XP242 XP243 Mounter Name: Nozzle Spring DBPH0151 FUJIXP243 Nozzle Copper Gasket DEEM5391 FUJI XP243E Straight Foot Ring Light DEEM5463 XP243E Ring Light Imitation Bent Feet DNEH
With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development tr
Career Center | Melbourne, Florida USA | Management,Production,Quality Control
Technical Skills/Abilities: � Management � Quality Assurance � Strong Troubleshooting Skills � Strategic Planning � Employee Training � Quality Assurance � Problem Resolution � Mechanical/Technical Aptitude
SMTnet Express, June 19, 2014, Subscribers: 22851, Members: Companies: 13906, Users: 36363 Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints Y
ORION Industries | http://orionindustries.com/steel-rule-die.php
% in the direction of the grain, due to changes in humidity. Therefore, a 10 part could expand up to 0.2. Also, soft and dense foams and rubbers can have distorted edges when die cut
| http://etasmt.com/cc?ID=te_news_industry,24163&url=_print
: Low cooling rate when temperature is over solder’s melting point will lead to the excessive formation of co-boundary metal compounds and form big grain structure on solder joints easily, thus reducing soldering strength
