Electronics Forum | Thu Apr 18 14:00:35 EDT 2002 | Romain
Is anyone has experience on problems with press-fit on Ni/Au board finish. Connectors pins are SnPb finished. I am particulary interested by experiences or documentation in very agressive environmental conditions (avionics or space buisness) Thanks r
Electronics Forum | Mon Apr 29 05:25:13 EDT 2002 | ianchan
Hi, we do Sn plated I/O pinning insertion into Ni/Au thru' holes. no problems here so far, as we cater for the "interference" (fit-allowances) of the I/O pin into the thru' diameter, via improved PCB thru' hole designs. before this cater/considerati
The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish SMTnet Express October 19, 2012, Subscribers: 25598, Members: Companies: 9011, Users: 33828 The Morphology Evolution and Voiding of Solder Joints on QFN
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/fr-FR/divisions/efd/products/accessories-kits-and-auxiliary-equipment/2k-pistons
Pas besoin de cale ni de seconde opération Dépose au bon ratio Fonctionnement rapide et infaillible Compatible avec la plupart des
| https://www.eptac.com/wp-content/uploads/2007/10/webinar_eptac_10_17_07.pdf