Parts & Supplies: print paste pressure 2.0 bar on dek (2)

DEK BOOM 500MM BOARD CLAMPS

DEK BOOM 500MM BOARD CLAMPS

Parts & Supplies | Pick and Place/Feeders

101004 TRANSISTOR BC108 NPN 101020 POWER SUPPLY – UPRATED CURRENT 101047 SQUEEGEE MATERIAL 9.5 X 9.5 85-90 101081 CONNECTOR CIRCULAR 14WAY 97-3102A 101142 FRONT SQUEEGEE CARRIAGE 101143 OUTER MTG SQUEEGEE BLOCK 101145 COVER (TXT) 101146

Qinyi Electronics Co.,Ltd

DEK BOOM 500MM BOARD CLAMPS

DEK BOOM 500MM BOARD CLAMPS

Parts & Supplies | Pick and Place/Feeders

101004 TRANSISTOR BC108 NPN 101020 POWER SUPPLY – UPRATED CURRENT 101047 SQUEEGEE MATERIAL 9.5 X 9.5 85-90 101081 CONNECTOR CIRCULAR 14WAY 97-3102A 101142 FRONT SQUEEGEE CARRIAGE 101143 OUTER MTG SQUEEGEE BLOCK 101145 COVER (TXT) 101146

Qinyi Electronics Co.,Ltd

Technical Library: print paste pressure 2.0 bar on dek (3)

Using Lean Six Sigma to Optimize Critical Inputs on Solder Paste Printing

Technical Library | 2018-03-21 22:44:30.0

Solder paste printing is the first step in the surface mount manufacturing process for PCBA assembly. When the solder paste printing process is uncontrolled, defects can be produced, which may not become apparent until the PCBA is downstream. (...)This paper will discuss how Lean Six Sigma techniques were used to optimize the solder paste printing process. It will highlight how a cross-functional team used the structured Define, Measure, Analyze, Improve and Control (DMAIC) methodology to identify and control the critical inputs. The advantage of the Lean Six Sigma methodology is that it guides the team through the rigorous structured process so that all possible inputs are considered and the critical ones can be identified.

Kimball Electronics, Inc.

Size Matters - The Effects of Solder Powder Size on Solder Paste Performance

Technical Library | 2020-02-12 22:54:13.0

Solder powder size is a popular topic in the electronics industry due to the continuing trend of miniaturization of electronics. The question commonly asked is “when should we switch from Type 3 to a smaller solder powder?” Solder powder size is usually chosen based on the printing requirements for the solder paste. It is common practice to use IPC Type 4 or 5 solder powders for stencil designs that include area ratios below the recommended IPC limit of 0.66. The effects of solder powder size on printability of solder paste have been well documented.The size of the solder powder affects the performance of the solder paste in other ways. Shelf life, stencil life, reflow performance, voiding behavior, and reactivity / stability are all affected by solder powder size. Testing was conducted to measure each of these solder paste performance attributes for IPC Type 3, Type 4, Type 5 and Type 6 SAC305 solder powders in both water soluble and no clean solder pastes. The performance data for each size of solder powder in each solder paste flux was quantified and summarized. Guidance for choosing the optimal size of solder powder is given based on the results of this study.

FCT ASSEMBLY, INC.

Express Newsletter: print paste pressure 2.0 bar on dek (954)

Partner Websites: print paste pressure 2.0 bar on dek (8)

DEK 03iX SMT Screen Printers

Goldland Electronic Technology Company Limited | https://www.feedersupplier.com/quality-13119482-dek-03ix-smt-screen-printers

DEK Horizon 03iX Screen Printern     Model: 03iX DEK Horizon 03iX Machine Standard Configuration:     Standard Configuration  Specification Machine Alignment Capability >2.0 Cpk @ +/- 12.5µm, (±6 Sigma

Goldland Electronic Technology Company Limited

Shop - Page 2 of 28 - Lewis and Clark

| https://www.lewis-clark.com/shop/page/2/

?dl=0 Out Of Stock 2008 Mirtec MV7-Xi AOI Make: Mirtec Model: MV7-Xi Vintage: 2008 Details: 5 Cameras Bar Code NG Marking 2.0 Software 2048 x 2048 Resolution Condition:  Complete


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Count On Tools, Inc.
Count On Tools, Inc.

COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.

Contract Manufacturer / Manufacturer of Assembly Equipment / Manufacturer of Assembly Material / Pick and Place / Repair / Rework

2481 Hilton Drive
Gainesville, GA USA

Phone: (770) 538-0411

pcb assembly supplies

High Resolution Fast Speed Industrial Cameras.
Dual Lane Reflow Oven

High Speed Precision In-Line SPI System - Mirtec MS-11
SMT & Related Equipment - Delta Tau Data Systems Inc.

World's Best Reflow Oven Customizable for Unique Applications