Hand tools and production aids. Tweezers, Pliers, Wire Cutters, Vacuum pick up
Our experienced engineers and technicians can craft processes that require a variety of surface mount technology (SMT) and plated through-hole (PTH) assembly techniques. ACI can assist manufacturers that require process development with solder alloy
Mechanical data Working stroke: 4,3 mm (.169) Maximum stroke: 6,35 mm (.250) Spring force at work. stroke: 0,8 N (2.9oz) Materials Plunger: Steel or BeCu, gold-plated Barrel: Bronze, gold-plated Spring: Steel, gold-plated Receptacle: Nickel-silver,
Electronics Forum | Wed Jan 24 10:20:39 EST 2007 | electronhose
Seriously, OSP?, change the board finish, you are the OEM, correct? You have the power! Also, as another poster mentioned, high force applied at ICT ( possibily to cut through the OSP goop ?!? ) could be warping the board enough to crack the joints.
Electronics Forum | Fri Mar 29 07:53:12 EDT 2019 | davef
Why are you printing paste on test via? In the old days, we probed soldered pads to cushion impact force of probing. Is that still a reasonable practice?
Industry News | 2011-12-14 16:19:46.0
MIRTEC announces that ACD purchased two Mv-7xi In-Line AOI Systems during the recent Productronica Trade Fair in Germany. ACD has very high inspection standards and the new MV-7xi AOI systems will help the company continue to meet or exceed those requirements.
Industry News | 2017-12-12 19:05:18.0
ECT switch probes are cost effective and reliable solutions for non-destructive testing to verify the presence of components or contact leads within a connector assembly. ECT offers proven off-the-shelf options and a large portfolio of custom switch probes. ECT’s experience and design standards combined with its knowledge of materials and platings allows for the quick alignment of probe features with project requirements. ECT switch probes are replaceable by using of one of many receptacle termination options. Customers can choose from gold or nickel plated plungers.
Parts & Supplies | General Purpose Equipment
P/No: HTJ-25A OAL: 1.25" (31,8 mm) Plunger length: .279" (7,1 mm) Full Travel: .220" (5,6 mm) Working travel: .167" (4,2 mm) Spring force: 3.5 oz (100cN) at working travel. The compliant motion of the ECT hanger style probe
Technical Library | 2021-05-20 13:55:14.0
Quality Control is essential in production processes. In the PCB Assembly process there are several Quality Control steps or options. The most popular tests are the electrical (In-Circuit or ICT) and the function (functional or FCT/FVT) test. ICT test fixtures are standardized and there are several major test platforms available which are industry standards. For FCT applications there are many more variations possible due to the vast number of testers and interface approaches unique to each customer; also due to an endless list of applications which fall under the category of Functional Test (RF, High Current, LED test, Leak test etc.) Test Probes are a very important part in ICT as well as in FCT applications. If the wrong test probe (type, spring force, tip style etc.) is used, the test fixture will not work as intended. In addition the test probe must be installed correctly in order to work properly. This presentation will show general information and some guidelines for a proper Test Fixture design to assure the most efficient production.
Technical Library | 2015-08-20 15:18:38.0
Increasing system integration and component densities continue to significantly reduce the opportunity to access nets using standard test points. Over time the size of test points has been drastically reduced (as small as 0.5 mm in diameter) but current product design parameters have created space and access limitations that remove even the option for these test points. Many high speed signal lines have now been restricted to inner layers only. Where surface traces are still available for access, bead probe technology is an option that reduces test point space requirements as well as their effects on high speed nets and distributes mechanical loading away from BGA footprints enabling test access and reducing the risk of mechanical defects associated with the concentration of ICT spring forces under BGA devices. Building on Celestica's previous work characterizing contact resistance associated with Pr-free compatible surface finishes and process chemistry; this paper will describe experimentation to define a robust process window for the implementation of bead probe and similar bump technology that is compatible with standard Pb-free assembly processes. Test Vehicle assembly process, test methods and "Design of Experiments" will be described. Bead Probe formation and deformation under use will also be presented along with selected results.
Example of Digitaltest's MTS 500 Condor system on a pcb panel.
http://paceworldwide.com/products/conductive-rework-systems/prc-2000/prc-2000-pace-repair-center-the-benchtop The PRC 2000 Benchtop Factory is the ultimate rework center. The PRC 2000 can tackle just about any Thru-Hole, SMT application and is well
Novel Probing Concepts for Mass-Production Tests: Design and Challenges SMTnet Express June 15, 2012, Subscribers: 25268, Members: Companies: 8896, Users: 33235 Novel Probing Concepts for Mass-Production Tests: Design and Challenges First
Lewis & Clark | http://www.lewis-clark.com/
Gear Feeders Flying Probe Glue Dispenser ICT Laser Marker-InkJet Marker Lead Former Other Pick & Place Feeder carts and trolleys Press Reflow Oven Rework Station Router Screen Printer Selective Solder Service Spare-Parts SPI- Solder Paste Inspection Systems Uncategorized Wave Solder Wire Bonder
GPD Global | https://www.gpd-global.com/features-surfacesense-max.php
Nozzles Real Time Process Control (FPC) Lead Formers Lead Formers Selection Axial Lead Former Radial Lead Former Peel Force Tester Peel Back Force Tester Applications APPLICATIONS OVERVIEW Conductive Adhesive Non-Conductive Adhesive Dam
