Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2022-06-27 17:04:51.0
In today's Electronics Manufacturing Industry, standards for defect and quality control are stricter than ever due to advancements of electronic products and increasing safety and environmental regulations. Electronics Manufacturers are forced to maximize their production efficiency by implementing lean manufacturing initiatives and optimizing production processes. With this in mind, manufacturers are relying upon Automated Optical Inspection (AOI) equipment to streamline the manufacturing process and provide real time root cause analysis of manufacturing defects. The objective is to increase profitability by improving production yields and reducing costly rework.
Technical Library | 2023-09-15 11:40:46.0
Improve your PCB assembly process with our advanced offline PCBA router machine. Achieve precision and speed in PCB separation for top-quality results
Technical Library | 2023-09-15 09:49:47.0
Explore our I.C.T IR Curing Oven Introduction to optimize your PCB assembly process. Learn how our cutting-edge ovens can improve efficiency and reliability in curing processes.
Technical Library | 2023-09-15 10:05:59.0
Elevate your electronics manufacturing with SMT Online AOI. Achieve real-time quality control, defect detection, and production efficiency optimization with our advanced automated optical inspection system. Improve your production process and ensure top-notch quality with SMT Online AOI technology.
Technical Library | 2019-06-03 15:32:40.0
ACI Technologies was pleased to assist a customer by conducting elemental analysis on several assemblies displaying severe corrosion. Several board assemblies had failed in the field and exhibited areas of corrosion in close proximity to onboard components. The most common source of corrosion on electronic assemblies is residual flux. Fluxes are specific chemistries applied during the soldering process which improve the wetting of the solder to both the pad and component when forming the solder joint. They can be highly reactive chemicals that, if left on the assemblies, can lead to corrosion, electrical degradation, and decreased reliability. In the presence of moisture and electrical bias, flux residue can enable dendritic growth as a result of electrochemical migration (ECM).
Technical Library | 2023-09-13 13:07:16.0
Pneumatic stencil cleaning machines are a great way to improve the efficiency and effectiveness of your stencil cleaning process. These machines use compressed air to remove contaminants and debris from stencils, which can cause defects and reliability issues.
Technical Library | 2023-09-13 13:10:06.0
Pneumatic stencil cleaning machines are a great way to improve the efficiency and effectiveness of your stencil cleaning process. These machines use compressed air to remove contaminants and debris from stencils, which can cause defects and reliability issues.
Technical Library | 2019-05-30 11:04:03.0
There exists a need to efficiently remove heat from power electronics within power systems to enhance performance. Thermal management is a critical function to that operation. Reducing the junction temperature of semiconductor power electronic devices enables them to operate at higher currents. Lowering operating temperatures reduces the thermal stress on electronic devices, which improves efficiency and reduces failures. To improve the heat removal process, the current heat transfer design of a power system has been analyzed and a variety of thermal interface materials (TIMs) and cold plate technologies have been evaluated. This paper will review some of these results.
Technical Library | 2023-09-15 09:53:02.0
Enhance your electronics manufacturing process with our SMT AOI solution. Achieve superior quality control and product reliability through advanced automated optical inspection technology. Improve production efficiency and reduce defects with our comprehensive AOI solution.
