Industry Directory: profile qsv1 plus (2)

Purex International LLP

Purex International LLP

Industry Directory | Assembly / Environmental Resources / Soldering

Manufacturer of the range of Fume Extraction & Purification Systems. These systems are designed to extract and purify fumes from laser processes, hand tool soldering and SMT equipment etc.

Clear Concepts Inc.

Clear Concepts Inc.

Industry Directory | Recruiter / Employment Company

As a well known and respected member of the search industry, Clear Concepts has been a partner in many critical search situations. From confidential replacement of incumbents to finding the key people for high growth startups and turnaround efforts,

New SMT Equipment: profile qsv1 plus (659)

3D SPI-6500 solder paste thickness gauge

3D SPI-6500 solder paste thickness gauge

New Equipment | Assembly Services

Detailed introduction of 3D spi-6500 solder paste thickness gauge  Product function 1. Friendly programming interface 2. Multiple measurement methods 3. The scanning distance is adjustable 4. 3D simulation function of image 5. Independent

KingFei SMT Tech

Allen Bradley	2711-B5A8	panelview plus 6

Allen Bradley 2711-B5A8 panelview plus 6

New Equipment | Industrial Automation

Company profile Cambia Automation Limited is a trade company in China. Main business have Bently Nevada , Honeywell , ABB , Allen Bradley , GE Fanuc , Triconex , Siemens ,etc. We have thoughful customer service, can help you to expand your business

Cambia Automation Limited

Electronics Forum: profile qsv1 plus (109)

Quad qsv1 plus

Electronics Forum | Mon Jan 20 05:15:21 EST 2020 | bobpan

Hello, You have a tep initialize issue. Please contact me. If you need my email go to my website and i would be glad to help. www.precision-repairs.com Bob

Quad qsv1 plus

Electronics Forum | Mon Jan 20 03:50:37 EST 2020 | falconex_technician

Hi, my company bough second hand pick and place as our second machine. After first transport after start just when initializing, It's showing problem with Z calibration. After second position setup and connect again after month, now showing &

Used SMT Equipment: profile qsv1 plus (31)

Speedline Speedline Bravo 8105

Speedline Speedline Bravo 8105

Used SMT Equipment | Soldering - Reflow

Configuration: ● edge/mesh ● Dual Air cooling zones ● left to right transfer ● chain oilers ● SMEMA VERSATILE, DURABLE, HIGH-PERFORMANCE REFLOW AT A VERY COMPETITIVE PRICE The Bravo 8105 is a forced convection reflow oven with eight top an

Capital Equipment Exchange

Quad QSV-1 Plus

Quad QSV-1 Plus

Used SMT Equipment | Pick and Place/Feeders

Runs, good condition, multiple parts, a lot of feeders.

REDCOM EMS

Industry News: profile qsv1 plus (64)

Essemtec's Compact Desk Reflow and Curing Oven Offers Lead-Free Soldering Capability

Industry News | 2008-12-03 16:12:20.0

The RO06-PLUS batch oven from Essemtec offers lead-free soldering capability as well as curing programs with durations up to 18 hours. The oven features a small footprint, integrated microprocessor control and fully automatic processing. Its main applications include prototyping, small batch manufacturing and testing.

ESSEMTEC AG

Live Interactive Video Broadcast from Precision PCB Services, Inc.

Industry News | 2016-01-13 13:37:12.0

Precision PCB Services, Inc. to provide a series of live interactive video broadcast on BGA Component Rework.

Precision PCB Services, Inc

Technical Library: profile qsv1 plus (50)

An Air-Assisted "Airless" Conformal Coating Process

Technical Library | 1999-08-27 09:18:58.0

A need to move beyond aerosol sprays and dipping leads to a development that answers tough requirements for controlled coverage, low waste, and environmental restrictions.

Nordson ASYMTEK

Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection?

Technical Library | 2020-11-04 17:49:45.0

OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.

ZESTRON Americas

Videos: profile qsv1 plus (9)

SRT BGA Rework Station Demo Part 1

SRT BGA Rework Station Demo Part 1

Videos

Exploring the software operation of an SRT 1000 BGA Rework Station. Profile set up and basic software operation. http://www.pcb-repair.com/bga-rework-station/

Precision PCB Services, Inc

Automatic Profiling Explained

Automatic Profiling Explained

Videos

A white board explanation of how KIC's automatic profiling works. Animation is in English.

KIC Thermal

Events Calendar: profile qsv1 plus (1)

SMT Boot Camp Featuing Phil Zarrow

Events Calendar | Tue Nov 29 09:00:00 EST 2016 - Thu Dec 01 09:00:00 EST 2016 | Rolling Meadows, Illinois USA

SMT Boot Camp Featuing Phil Zarrow

BEST Inc.

Career Center - Resumes: profile qsv1 plus (14)

2012 resume

Career Center | Columbus, Ohio USA | Engineering,Management,Production,Quality Control,Research and Development,Technical Support

20 plus years of experience in a Electronics Manufacturing environment. Management experience on 1st and 2nd shift with groups up to 18 in a goverment contracted environment Experienced internal/lead auditor of ISO 9001 with years of audit experi

2012 resume

Career Center | Columbus, Ohio USA | Engineering,Management,Production,Quality Control,Research and Development,Technical Support

20 plus years of experience in a Electronics Manufacturing environment. Management experience on 1st and 2nd shift with groups up to 18 in a goverment contracted environment Experienced internal/lead auditor of ISO 9001 with years of audit experi

Express Newsletter: profile qsv1 plus (472)

SMT Express, Volume 2, Issue No. 9 - from SMTnet.com

SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Reflow Profiling The Benefits of Implementing a Ramp-to-Spike Profile by David Suraski /AIM

Partner Websites: profile qsv1 plus (1010)

Dispersogen SP Plus

Clariant Cargo & Device Protection | https://www.clariant.com/en/Solutions/Products/2018/10/03/11/01/Dispersogen-SP-Plus

Dispersogen SP Plus Search Share Region Contact Close Close Search If you are searching for Safety Data Sheets, please visit our Document Finder All Results Close Facebook Twitter LinkedIn E-Mail

Clariant Cargo & Device Protection

3D Plus Component - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1783&OB=DESC.html

3D Plus Component - PCB Libraries Forum   Forum Home > PCB Library Expert > Questions & Answers    New Posts    FAQ    Search    Events    Register    Login 3D Plus Component

PCB Libraries, Inc.


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