Industry News | 2010-07-08 12:45:56.0
Working together to address the latest round of proposed substance restrictions, IPC and the Indian Printed Circuits Association (IPCA) have submitted comments in response to the Indian Government’s Ministry of Environment and Forests draft notification of E-waste (Management and Handling) Rules 2010.
Industry News | 2020-09-22 11:08:38.0
IPC today joined with almost 40 other groups in calling on European Commission President Ursula von der Leyen to postpone the January deadline for a new chemicals database and to study related issues further before it goes forward.
Industry News | 2012-10-31 15:53:31.0
B revision of IPC/WHMA-A-620, Requirements and Acceptance for Cable and Wire Harness Assemblies. This important industry standard is a joint effort of IPC — Association Connecting Electronics Industries® and the Wire Harness Manufacturer’s Association (WHMA).
Industry News | 2023-02-27 18:51:40.0
IPC issues February Global Sentiment of the Electronics Supply Chain report
Industry News | 2010-05-26 13:06:11.0
BANNOCKBURN, Ill., USA — In communications sent to Members of the European Parliament (MEPs) last week, IPC — Association Connecting Electronics Industries® lent its support to the adoption of RoHS Directive proposed amendments 197 through 203. These amendments support the use of a rigorous scientific methodology to evaluate additional restricted substances and their alternatives.
Industry News | 2021-05-21 04:38:58.0
Secretary Raimondo to Hold Summit with Industry Leaders Today to Address Chips Shortage Crisis
Industry News | 2019-10-22 12:34:34.0
Humitector™ Type 2 delivers advanced sustainable attributes including halogen-free*, cobalt dichloride-free, and reduced cobalt dibromide content The use of Type 2 Humidity Indicator Cards with a non-reversible 60% RH spot indicator is preferred by IPC/JEDEC standard J-STD-033D.
Industry News | 2016-08-28 13:49:20.0
Altus Group, leading distributors of capital equipment for electronics assembly and Accelonix, dominant suppliers of electronic and precision manufacturing and test equipment have partnered to present an innovative technology showcase on 29th September 2016.
Industry News | 2015-02-17 10:38:29.0
At IPC APEX 2015 Digitaltest are showing the integration of all test processes to accurately locate defects, increase fault coverage, provide the focus to improve your process and increase quality.
Industry News | 2017-08-02 07:12:18.0
As market leader in bond testing, XYZTEC is pushing the technology forward. In this month's newsletter we highlight the recent advances in thin, 3D and MEMS die bond testing. As developments in thin die change the shape of our customers' products, three fundamental difficulties for the bond test have to be overcome: