Electronics Forum | Wed Mar 14 12:06:15 EDT 2007 | Oswaldo Rey
There is an approximate 1W dissipation and has a 2 sq in area below part on solder side as a heat sink, vias are to physically conect this solder side area to power pad, so its necessary to use an adequate amount of paste. I really don�t think it has
Electronics Forum | Tue Mar 13 17:29:18 EDT 2007 | Oswaldo Rey
I placed a Maxim MAX16810 38 pin TQFN with a power pad ground on the bottom of the chip on a prototype board FR4 doble sided. Vias of 0.6 mm where placed underneath part, 6 vias in total. Solder was placed with an air operated syringe, land pattern w
Electronics Forum | Fri Oct 16 14:45:58 EDT 2009 | cyber_wolf
Many pick and place platforms rely on nozzle spring pressure to determine how hard a part is getting pushed into the paste.
Electronics Forum | Tue Jan 14 11:39:51 EST 2020 | avillaro2020
Thanks Robl. I’ve contacted samtec followed their advice but ended up empty handed. Originally my stencil thickness is 6 mils, samtec stressed the need for the paste and charge to have good contact but this is challenged by the inherent charge non-co
Electronics Forum | Tue Jan 14 19:41:32 EST 2020 | avillaro2020
Hi Evtimov, Thanks for your response. Yes, the vapour phase is suppose to handle big and heavy boards, at least thats the intention. Well our thin board is like around 3mm which is not really thin. In our application the thicker the boards means more
Electronics Forum | Sun Mar 12 13:09:33 EST 2000 | Jeff Wilson
Jeff, The problem you are describing MAY be related to the push up pin setting on your component feeder units. Please verify that the push up pin height is set correctly for the feeder units, and the nozzle pick-up and placement heights are to the c
Electronics Forum | Sun Mar 12 13:09:33 EST 2000 | Jeff Wilson
Jeff, The problem you are describing MAY be related to the push up pin setting on your component feeder units. Please verify that the push up pin height is set correctly for the feeder units, and the nozzle pick-up and placement heights are to the c
Electronics Forum | Mon Jul 12 17:32:53 EDT 2004 | Petros
Can anyone tell me if the Panasonic K-style green emboss 08x04 feeders can be used interchangably with the white paper ones? If so what is the importance of the push pin and are there settings in the machine that need to be changed? Also is this (whi
Electronics Forum | Thu Jul 15 13:41:23 EDT 2004 | Claude_Couture
We use paper tape in green emboss feeder without problems. But you can't use emboss tape in white paper feeder because the bottom of the tape needs a channel so the tape is supported on two side. Also, we remove all push pins. they are useless. We ne
Electronics Forum | Mon Mar 13 08:59:21 EST 2000 | Jeff
Jeff, We do not use push up pin. The nozzle pick-up and placement heights are checked many times. We are looking for wich component can break the nozzles. Thanks for your help, Jeff.
