Industry Directory | Distributor / Manufacturer
Equip-Test with Global Headquarter in Budapest Metropolitan Area, Europe is a global player in manufacturing PCB test equipment.
Industry Directory | Manufacturer
XYZTEC is the market and technology leader in bond testing worldwide. The Condor Sigma is the most advanced bond tester, providing leading customers with fully automated shear, push and pull testing.
Semi-automatic Screwdriver Automatic feeding Smart control Big screw compartment Automatic counting Semi-automatic Screwdriver Main specifications: Product model SZ2800S Product size 410*163*266.5mm Product
New Equipment | Board Handling - Conveyors
PCB Magazine Buffer Machine 1. “Panasonic” PLC. 2. Touch screen control. 3. Acoustic-optic alarm system. 4. The lifting step can be set. 5. Standard SMEMA. 6. Magazine-type buffer, can pass good PCB directly to the next machine and store the fair bo
Electronics Forum | Wed May 29 04:34:36 EDT 2002 | Nell
Hi, Does anyone know about the epoxy push test specifications for the SMT chips component. For example: 0603, 0402 and 0201 chips. As usual, your help is very much appreciated. Thanks in advance, Nell
Electronics Forum | Wed May 29 10:14:04 EDT 2002 | Hussman69
You mean the destructive test were you continually push on a part until it breaks free from the board and flies across the room?
Used SMT Equipment | Conveyors
Universal Instruments End of Line Magizine Unloader with UIC Push Conveyor 110 VAC and clean dry shop air required. Powered up and functionality tested, L to R board flow. Contact Assured Technical Service for details Minneapolis, MN 55441
Used SMT Equipment | General Purpose Test & Measurement
The 2975 pushes testing technology to a higher level. For Project 25 complete transmitter spectrum performance testing, swept antenna and transmission line testing and at-a-glance troubleshooting, the 2975 comes standard with a digitized 2.7 GHz spec
Industry News | 2014-04-27 12:59:18.0
MIRTEC, “The Global Leader in Inspection Technology,” announces that it has been awarded a 2014 EM Asia Innovation Award in the category of Test & Measurement / Inspection Systems – AOI for its MV-7 OMNI.
Industry News | 2003-06-16 09:12:35.0
Boards tout up to 8MGates devices, on-board RAM, banks of I/O, many programmable user interfaces
Parts & Supplies | SMT Equipment
PUSH UP BELT if need more info about the products , pls don’t hesitate to contact with us at any time.More info pls visit our website:www.ksunsmt.com. Email: alice@ksunsmt.com Skype: alice@ksunsmt.com Whats app: +86 13170471806 MP: 008
Parts & Supplies | SMT Equipment
PUSH UP BELT FOR YV100X if need more info about the products , pls don’t hesitate to contact with us at any time.More info pls visit our website:www.ksunsmt.com. Email: alice@ksunsmt.com Skype: alice@ksunsmt.com Whats app: +86 1317047180
Technical Library | 2017-04-13 16:14:27.0
The drive to reduced size and increased functionality is a constant in the world of electronic devices. In order to achieve these goals, the industry has responded with ever-smaller devices and the equipment capable of handling these devices. The evolution of BGA packages and leadless devices is pushing existing technologies to the limit of current assembly techniques and materials.As smaller components make their way into the mainstream PCB assembly market, PCB assemblers are reaching the limits of Type 3 solder paste, which is currently in use by most manufacturers.The goal of this study is to determine the impact on solder volume deposition between Type 3, Type 4 and Type 5 SAC305 alloy powder in combination with stainless steel laser cut, electroformed and the emerging laser cut nano-coated stencils. Leadless QFN and μBGA components will be the focus of the test utilizing optimized aperture designs.
Technical Library | 2023-06-12 19:00:21.0
The SMT print process is now very mature and well understood. However as consumers continually push for new electronic products, with increased functionality and smaller form factor, the boundaries of the whole assembly process are continually being challenged. Miniaturisation raises a number of issues for the stencil printing process. How small can we print? What are the tightest pitches? Can we print small deposits next too large for high mix technology assemblies? How closely can we place components for high density products? ...And then on top of this, how can we satisfy some of the cost pressures through the whole supply chain and improve yield in the production process! Today we are operating close to the limits of the stencil printing process. The area ratio rule (the relationship between stencil aperture opening and aperture surface area) fundamentally dictates what can and cannot be achieved in a print process. For next generation components and assembly processes these established rules need to be broken! New stencil printing techniques are becoming available which address some of these challenges. Active squeegees have been shown to push area ratio limits to new boundaries, permitting printing for next generation 0.3CSP technology. Results also indicate there are potential yield benefits for today's leading edge components as well. Stencil coatings are also showing promise. In tests performed to date it is becoming apparent that certain coatings can provide higher yield processing by extending the number of prints that can be performed in-between stencil cleans during a print process. Preliminary test results relating to the stencil coating technology and how they impact miniaturisation and high yield processing will be presented.
The Access Control Face Recognition system is a very widely used product. It is currently not only used in residential buildings and office buildings, but also in many scenarios. For example, corporate attendance: Some companies also use the acces
link: https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_loader/87.html The automatic PCB magazine loader is used at the starting of the SMT production line for loading of PCBA to the line.he unit loads the production line automatically by pu
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Wed Feb 14 00:00:00 EST 2024 - Fri Feb 16 00:00:00 EST 2024 | San Francisco, California USA
Wafer-Level Packaging Symposium
Events Calendar | Tue Feb 15 00:00:00 EST 2022 - Thu Feb 17 00:00:00 EST 2022 | San Jose, California USA
Wafer-Level Packaging Symposium
Career Center | Hawthorne, California USA | Production
MANUFACTURING SPECIALIST (STARLINK) Hawthorne, CA, United States SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively develop
Career Center | north augusta, South Carolina USA | Production,Quality Control
Detail oriented!
Career Center | north augusta, South Carolina USA | Production,Quality Control
I am a skilled smt operator that pays close attention to detail! With my experience in the electronic field for the passed 10 years proving to be an asset to all companies that i have worked for in providing quality work and ensuring on time delivery
Surface Mount Technology Association (SMTA) | https://www.smta.org/led/
LED Assembly, Reliability & Testing Symposium Menu + Home Technical Program Technical Program For Speakers Exhibit/Sponsor Hotel LED Assembly, Reliability
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/page/293?order=list_price+desc
parts Public Pricelist Public Pricelist Thin wire for testing jig 0.45mm / 0.25mm 1000 feet ¥ 0.00 0.0 CNY NXT H02F Head Valve Unit ¥ 0.00
