GKG GSE SMT Stencil Printer Frame size from 420×520mm to 737×737mm PCB size from 50×50mm to 400×310mm size: 1158*1362*1463mm Weight:1000Kg Product description: GKG GSE SMT Stencil Printer, Frame size from 420×520m
Flason SMT GKG GSE SMT Stencil Printer Gross Power: 50W Voltage: 220V size: 1158*1362*1463mm Weight:1000Kg Product description: GKG GSE SMT Stencil Printer Full Automatic-Good Price! Good Quality! Good Service! INQUIRY GKG GSE&
Electronics Forum | Thu Apr 29 01:49:10 EDT 1999 | Daniel J.M. Guibord
Can anyone in this world produce such small PCB/PWB trace widths? Lots of theory so far, but have not found anyone yet who can do it in practice.
Electronics Forum | Thu Apr 29 09:37:12 EDT 1999 | Dave F
| Can anyone in this world produce such small PCB/PWB trace widths? Lots of theory so far, but have not found anyone yet who can do it in practice. | Daniel: 2 mil lines with 3 mil spaces are pretty technical. Good luck. Dave F
Used SMT Equipment | THT Equipment
JUKI JM 50 Insertion Solution THT JUKI JM 50 Insertion Solution THT Lowest cost JUKI's JM-50 convinces with lowest entry costs for THT production when producing high-mix low-volume. Recognition of various component heights The new "Takumi head" has
Industry News | 2001-12-11 07:58:41.0
IPC has announced that preparations are well underway for IPC Printed Circuits Expo 2002. Now in its eighth year, IPC Printed Circuits Expo continues to be North America's largest exhibition and conference for the PCB industry with exhibitors currently contracted to fill Halls A, B and C of the Long Beach Convention Center.
Industry News | 2022-09-26 06:21:56.0
IPC's Validation Services Program has awarded an IPC-4101 Qualified Products Listing (QPL) to Taiwan Union Technology Corporation (TUC), an electronics materials manufacturing company headquartered in Zhubei, Hsinchu County, Taiwan.
Parts & Supplies | SMT Equipment
XMP card of KE2050 Professional maintenance JUKI SMT various circuit boards: JUKI CPU motherboard, SUB-CPU board, laser control board, servo drive card, X / Y / Z / Q-axis drive, 24V power supply card, head boards, image control card, I / O board
Technical Library | 2013-01-09 18:31:54.0
The increased temperatures associated with lead free processes have produced significant challenges for PWB laminates. Newly developed laminates have different curing processes, are commonly filled with ceramic particles or micro-clays and can have higher Tg values. These changes designed to reduce Z-axis expansion and improve the materials resistance to thermal excursions through primary attach and rework operations have also produced harder resin systems with reduced fracture toughness.
Technical Library | 2022-10-11 20:15:14.0
The increased temperatures associated with Pb-free processes have produced significant challenges for PWB laminates. Newly developed laminates have different curing processes, are commonly filled with ceramic particles or micro-clays and can have higher Tg values. These changes which are aimed at improving the materials resistance to thermal excursions and maintaining electrical integrity through primary attach and rework operations have also had the effect of producing harder resin systems with lower fracture toughness.
Career Center | Murphy, North Carolina USA | Engineering
We are seeking a qualified and experienced senior design engineer to join our team. The best candidate will use both mechanical and electrical engineering skills to design innovative power supplies that are highly efficient, rugged, and have high rel
Career Center | Poplar Grove, Illinois | Engineering,Production,Quality Control,Technical Support
Please see resume.
Career Center | Poplar Grove, Illinois USA | Management,Production,Quality Control,Technical Support
20+ years in electronic manufacturing, sales support,customer support.
| https://www.eptac.com/instructors/
. Pritchard Hall of Fame Achievements Co-founder of IPC Designers Council Spearheaded IPC PWB Designers Certification Program Key Master Instructor in training numerous designers in CID and CID
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. The LSLP reflow profile produced minimal voiding whereas the Extreme reflow profile resulted in voiding as large as 60% of the solderball diameter
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