Supplier: Shenzhen Grande Electronic Layers: 4 Application: Weighing Scales PCB Assembly - Fast Electronic Prototype PCB:FR-4/1.6mm, 2oz finished copper Specialty: Large current, High heat, heavy components Surface Treatment:
Supplier: Shenzhen Grande Electronics Layers:2 Application: Level Transmitter PCB Assembly - Electronic Contract Manufacturing - Grande Electronics PCB: FR4/1.0mm, 1oz finished copper Min Via: 0.2mm Surface Treatment: HASL P
Hello and thank you for your interest in our BTU Pyramax 98N Reflow Oven. The oven is in Perfect to Like New Condition. Year 2007-2008 Lead Free Max Temp: 350 7 Heating Zones Top and Bottom 2 Cooling Zones Right to Left Flow Edge Rail
Industry News | 2008-09-25 15:52:38.0
NORTH BILLERICA, Mass., September 2008 � BTU International (Nasdaq: BTUI), a leading supplier of advanced thermal processing equipment for the alternative energy and electronics manufacturing markets, will promote the Pyramax 75 in booth 812 at the upcoming IPC Midwest show, which will take place September 24-25, 2008 in Schaumburg, IL. The Pyramax 75 will be highlighted electronically via an informative PowerPoint presentation. Additionally, company representatives will be available to discuss the system's key features, benefits and more.
Industry News | 2008-07-19 14:06:23.0
NORTH BILLERICA, Mass., July 16, 2008�BTU International, Inc. (Nasdaq: BTUI), a leading supplier of advanced thermal processing equipment for the alternative energy and electronics manufacturing markets, today was presented with an Advanced Packaging Award in the Reflow Equipment category for its Pyramax 100 reflow oven. The award was presented during the Advanced Packaging Award ceremony that took place on Wednesday, July 16, 2008 at the St. Regis Hotel Conservatory during the SEMICON West exhibition in San Francisco.
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Technical Library | 2017-11-15 22:49:14.0
While a significant level of voiding can be tolerated in solder joints where electrical conductivity is the main requirement, voiding at any level severely compromises thermal conductivity. For example, in LED lighting modules effective conduction of heat through the 1st level die attach to the substrate and then through the 2nd level attach to the heat sink is critical to performance so that voiding in the solder joints at both levels must be minimized. (...) In this paper, the authors will review the factors that influence the incidence of voids in small and large area solder joints that simulate, respectively, the 1st and 2nd level joints in LED modules and discuss mitigation strategies appropriate to each level. They will also report the results of a study on the effect on the incidence of voids of flux medium formulation and the optimization of the thermal profile to ensure that most of the volatiles are released early in the reflow process.
Technical Library | 2014-03-06 19:04:07.0
Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies.
& Jetting to a Whole New Level Nordson ASYMTEK Get Ready. Set. And Jet to Productronica Stand A2.461 Get on Board with Nordson ASYMTEK at IPC APEX Expo Booth 2125 Nordson ASYMTEK Demonstrations of large-volume and advanced dispensing, hot bar soldering, and a conformal coating line Jetting
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