Minimizing Voiding In QFN Packages Using Solder Preforms SMTnet Express July 27, 2012, Subscribers: 25333, Members: Companies: 8933, Users: 33366 Minimizing Voiding In QFN Packages Using Solder Preforms First published in the 2012 IPC APEX EXPO
The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish SMTnet Express October 19, 2012, Subscribers: 25598, Members: Companies: 9011, Users: 33828 The Morphology Evolution and Voiding of Solder Joints on QFN
Surface Mount Technology Association (SMTA) | https://www.smta.org/icehet/workshops.cfm
field experience with scientific research to solve everyday problems. These half-day courses are led by internationally respected professionals with extensive experience in the subject area
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/industries/electronics-assembly-and-packaging?page=24
manufacturing equipment at Nordson Electronics assembly and packaging requires precise dispensing of materials. At Nordson, we understand the needs of those in electronics manufacturing and have years of experience providing bondtesters, dual dispensers with valves that cut time in half, fluid regulators
